Surface plate protecting device in CMP apparatus

Abstract

Damage of a surface plate used in a CMP apparatus due to troubles generated in repair or replacement of the surface plate, operation of the CMP apparatus, etc. is prevented. In order to solve the problem, the present invention provides a surface plate protecting device in the CMP apparatus, which is a surface plate 2 used in the CMP apparatus, wherein a polishing pad 16 is replaceably bonded with the upper surface of a sheet 8, and the lower surface of the sheet 8 is bonded with the upper surface of the surface plate 2 by an adhesive agent 9 having adhesive force larger than the adhesive force of the polishing pad 16, so that damage or the like of the surface of the surface plate 2 generated due to troubles, etc. in polishing of a wafer can be blocked by the sheet 8.

1 . A surface plate protecting device in a CMP apparatus comprising a surface plate used in the CMP apparatus, wherein a sheet is bonded with an upper surface of the surface plate by an adhesive agent, a polishing pad is further replaceably bonded with the upper surface of the sheet, so that damage of the surface of the surface plate generated in replacement of the polishing pad, wafer polishing, or the like is protected by the sheet. 
     
     
         2 . The surface plate protecting device in the CMP apparatus according to  claim 1 , wherein the adhesive force of the adhesive agent bonding the upper surface of the surface plate with the sheet is larger than the adhesive force of the polishing pad. 
     
     
         3 . The surface plate protecting device in the CMP apparatus according to  claim 1  or  2 , wherein a chemically resistant material such as a fluorine resin is selected as the sheet. 
     
     
         4 . The surface plate protecting device in the CMP apparatus according to  claim 1  or  3 , wherein a lower surface of the sheet is subjected to surface treatment that increases a friction coefficient, and the adhesive agent bonding the lower surface of the sheet with the upper surface of the surface plate uses an adhesive agent having adhesive force equal to or more than the adhesive force of the polishing pad. 
     
     
         5 . A surface plate protecting device in a CMP apparatus comprising a surface plate used in the CMP apparatus, wherein a sheet protecting a surface of the surface plate is provided, both sides of the sheet are respectively coated by adhesive agents having different adhesive force, the adhesive agent of the lower surface side having the adhesive force larger than the adhesive force of the upper surface side, the lower surface of the sheet is bonded with the upper surface of the surface plate by the adhesive agent having the large adhesive force, and a polishing cloth is replaceably bonded with the upper surface of the sheet by the adhesive agent having the small adhesive force, so that damage of the surface of the surface plate generated in replacement of the polishing cloth, wafer polishing, or the like can be protected by the sheet. 
     
     
         6 . The surface plate protecting device in the CMP apparatus according to  claim 1 ,  2 , or  3 , wherein the surface of the sheet in the surface plate side is coated in advance by an adhesive agent having adhesive force larger than the adhesive force of the polishing pad, the sheet is bonded with the upper surface of the surface plate, and the polishing pad is bonded with the upper surface of the sheet. 
     
     
         7 . The surface plate protecting device in the CMP apparatus according to  claim 5  or  6 , wherein an outer coating sheet for preventing adhesion with another material is bonded with the surface of the adhesive agent coating the sheet.