Coating Composition for Forming Pattern and Coated Article
Abstract
A coating composition for forming a pattern includes a thermoplastic resin, magnetic particles with flaky form and a specific solvent. As the thermoplastic resin, a vinyl acetate based resin, an acryl based resin or a cellulose acetate butyrate resin is preferable. The specific solvent contains a low boiling point solvent having a boiling point of 50° C. or higher and 100° C. or lower, and a high boiling point solvent having a boiling point that is higher than 100° C. and 200° C. or lower. The coating composition for forming a pattern is set so that the viscosity 20 seconds to 60 seconds after application on the surface of an article to be coated is 2,000 mPa·s to 500,000 mPa·s in a normal state, and the viscosity between 60 seconds and 120 seconds after application is no lower than 100,000 mPa·s. In addition, the coating composition is set so that the viscosity between 60 seconds and 120 seconds after application is greater than the viscosity 20 seconds to 60 seconds after application.
Claims
exact text as granted — not AI-modified1 . A coating composition for forming a pattern, the composition being used for forming a coating film having a pattern, comprising:
a thermoplastic resin; magnetic particles with flaky form; a low boiling point solvent having a boiling point of 50° C. or higher and 100° C. or lower; and a high boiling point solvent having a boiling point that is higher than 100° C. and 200° C. or lower, wherein the viscosity 20 seconds to 60 seconds after application on a surface of an article to be coated is 2,000 mPa·s to 500,000 mPa·s in a normal state, the viscosity between 60 seconds to 120 seconds after application is no lower than 100,000 mPa·s, and is greater than the viscosity 20 seconds to 60 seconds after application, and said magnetic particles are oriented by a magnetic field after application, and thus, a coating film having a pattern is formed.
2 . The coating composition for forming a pattern according to claim 1 , wherein
said thermoplastic resin is a vinyl acetate based resin, an acryl based resin, or a cellulose acetate butyrate resin.
3 . The coating composition for forming a pattern according to claim 1 , containing a nonvolatile content of 5 mass % to 15 mass %.
4 . The coating composition for forming a pattern according to claim 1 , containing a dye as a coloring agent.
5 . The coating composition for forming a pattern according to claim 2 , wherein
said thermoplastic resin is a vinyl acetate-vinyl chloride copolymer resin or an acryl resin.
6 . The coating composition for forming a pattern according to claim 1 , wherein
said high boiling point solvent is made of two types of solvents having different boiling points.
7 . The coating composition for forming a pattern according to claim 6 , wherein
said high boiling point solvent includes a first high boiling point solvent having a boiling point that is higher than 100° C. and 150° C. or lower, and a second high boiling point solvent having a boiling point that is higher than 150° C. and 200° C. or lower.
8 . A coated article, in which a coating film having a pattern is formed on an article to be coated by applying the coating composition for forming a pattern according to claim 1 on the article to be coated, orienting said magnetic particles by a magnetic field, and then solidifying the coating composition in this state.
9 . A manufacturing method for the coating composition for forming a pattern according to claim 1 , comprising:
dissolving a thermoplastic resin in an organic solvent, thereby preparing resin solution; mixing magnetic particles with flaky form in the resin solution; and diluting the resin solution using a diluting solvent in which a low boiling point solvent having a boiling point of 50° C. or higher and 100° C. or lower, and a high boiling point solvent having a boiling point that is higher than 100° C. and 200° C. or lower are mixed together.
10 . The manufacturing method for the coating composition for forming a pattern according to claim 9 , wherein
said high boiling point solvent is prepared by mixing together a first high boiling point solvent having a boiling point that is higher than 100° C. and 150° C. or lower, and a second high boiling point solvent having a boiling point that is higher than 150° C. and 200° C. or lower.Join the waitlist — get patent alerts
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