US2008073218A1PendingUtilityA1

Plating solution of palladium alloy and method for plating using the same

Assignee: ISHIKAWA TOMOKOPriority: Sep 26, 2006Filed: Sep 21, 2007Published: Mar 27, 2008
Est. expirySep 26, 2026(~0.2 yrs left)· nominal 20-yr term from priority
C25D 3/567C01B 3/505B01D 53/228B01D 2323/48C25D 3/52B01D 67/0069
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Claims

Abstract

The present invention relates to a plating solution of palladium alloy and has an object to provide a plating solution of palladium alloy highly stable and capable of stably forming a plated film of a given alloy composition. The present invention relates to a plating solution of palladium alloy containing a palladium complex and a metal salt, wherein the palladium complex is coordinated with at least one neutral amino acid selected from the group consisting of glycine, alanine, valine, leucine, serine, threonine, asparagine, glutamine and tyrosine as a ligand.

Claims

exact text as granted — not AI-modified
1 . A plating solution of palladium alloy comprising a palladium complex and a metal salt, wherein the palladium complex is coordinated with at least one neutral amino acid selected from the group consisting of glycine, alanine, valine, leucine, serine, threonine, asparagine, glutamine and tyrosine as a ligand. 
     
     
         2 . The plating solution of palladium alloy according to  claim 1 , wherein the palladium complex is formed by dispersing, in a solvent, at least one palladium salt selected from the group consisting of palladium chloride, palladium sulfate, palladium nitrate, palladium hydroxide and palladium oxide, and the neutral amino acid. 
     
     
         3 . The plating solution of palladium alloy according to  claim 1 , wherein the metal salt is one of gold salt, silver salt and copper salt. 
     
     
         4 . The plating solution of palladium alloy according to  claim 1 , wherein the neutral amino acid is present at 0.1 to 2.0 mol/L. 
     
     
         5 . The plating solution of palladium alloy according to  claim 1 , wherein palladium is present at a concentration of 1 to 30 g/L as Pd. 
     
     
         6 . The plating solution of palladium alloy according to  claim 1 , wherein the metal salt is present at a concentration of 0.1 to 30 g/L as the metal. 
     
     
         7 . A palladium alloy plating method comprising forming a plated film with the plating solution of palladium alloy according to  claim 1 , carried out under the conditions of pH: 6 to 10, temperature: 30 to 80° C. and current density: 0.1 to 7.0 A/dm 2 . 
     
     
         8 . A hydrogen separation membrane produced by the palladium alloy plating method according to  claim 7 . 
     
     
         9 . The plating solution of palladium alloy according to  claim 2 , wherein the metal salt is one of gold salt, silver salt and copper salt. 
     
     
         10 . The plating solution of palladium alloy according to  claim 2 , wherein the neutral amino acid is present at 0.1 to 2.0 mol/L. 
     
     
         11 . The plating solution of palladium alloy according to  claim 3 , wherein the neutral amino acid is present at 0.1 to 2.0 mol/L. 
     
     
         12 . The plating solution of palladium alloy according to  claim 9 , wherein the neutral amino acid is present at 0.1 to 2.0 mol/L. 
     
     
         13 . The plating solution of palladium alloy according to  claim 2 , wherein palladium is present at a concentration of 1 to 30 g/L as Pd. 
     
     
         14 . The plating solution of palladium alloy according to  claim 3 , wherein palladium is present at a concentration of 1 to 30 g/L as Pd. 
     
     
         15 . The plating solution of palladium alloy according to  claim 9 , wherein palladium is present at a concentration of 1 to 30 g/L as Pd. 
     
     
         16 . The plating solution of palladium alloy according to  claim 4 , wherein palladium is present at a concentration of 1 to 30 g/L as Pd. 
     
     
         17 . The plating solution of palladium alloy according to  claim 10 , wherein palladium is present at a concentration of 1 to 30 g/L as Pd. 
     
     
         19 . The plating solution of palladium alloy according to  claim 11 , wherein palladium is present at a concentration of 1 to 30 g/L as Pd. 
     
     
         20 . The plating solution of palladium alloy according to  claim 12 , wherein palladium is present at a concentration of 1 to 30 g/L as Pd.

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