Plasma Display Panel

Abstract

A plasma display device that diversifies heat dissipating paths of integrated circuit modules in a circuit board assembly, thereby enhancing heat dissipation of the integrated circuit modules. The plasma display device includes a plasma display panel, a chassis base on which the plasma display panel is attached and supported, integrated circuit modules that are mounted on the circuit board assembly on an opposite side of the chassis base to the plasma display panel, and heat sinks, each being attached to one side of each of the integrated circuit modules to dissipate heat therefrom. The heat sink is formed such that one end thereof extends to come in contact with the chassis base.

1 . A display device comprising: 
 a display panel;    a chassis base to which the display panel is attached and supported;    at least one integrated circuit module mounted on a circuit board assembly, the at least one integrated circuit being disposed on the chassis base on a side opposite to the display panel;    at least one heat sink attached to the at least one integrated circuit module adapted to dissipate heat therefrom; and    an auxiliary heat sink connected to one side of the at least one heat sink.    
   
   
       2 . The display device of  claim 1 , wherein the at least one integrated circuit module is selected from one of the group of a surface mounted device type, a dual in-line package type, a hybrid integrated circuit type and an intelligent power module type.  
   
   
       3 . The display device of  claim 1 , wherein the display device is a plasma display device.  
   
   
       4 . The display device of  claim 1 , wherein the at least one heat sink is connected to the auxiliary heat sink via a heat dissipating pad.  
   
   
       5 . The display device of  claim 1 , wherein an end of the auxiliary heat sink contacts the chassis base.  
   
   
       6 . The display device of  claim 5 , wherein the auxiliary heat sink and the chassis base have a dissipating pad interposed therebetween.  
   
   
       7 . The display device of  claim 1 , wherein the at least one integrated circuit module is disposed at an edge of the circuit board assembly.  
   
   
       8 . The display device of  claim 1 , 
 wherein the at least one heat sink is attached to a side of the at least one integrated circuit module, and    wherein the auxiliary heat sink is attached to the side of the at least one integrated circuit perpendicularly with respect to the at least one heat sink.    
   
   
       9 . The display device of  claim 8 , wherein the at least one heat sink and the auxiliary heat sink have the same shape.  
   
   
       10 . The display device of  claim 8  wherein the auxiliary heat sink has an L-shape so as to be attached to one side of the at least one heat sink and to one side of the chassis base.