Integrated circuit package system with encapsulation lock

Abstract

An integrated circuit package system is provided including forming a paddle having a depression from a paddle top surface and an external interconnect, forming a lead tip and a lead body of the external interconnect, connecting a device over the paddle top surface and the external interconnect, and filling a substantially electrically nonconductive material in the depression.

1 . An integrated circuit package system comprising:
 forming a paddle having a depression from a paddle top surface and an external interconnect;   forming a lead tip and a lead body of the external interconnect;   connecting a device over the paddle top surface and the external interconnect; and   filling a substantially electrically nonconductive material in the depression.   
   
   
       2 . The system as claimed in  claim 1  further comprising:
 forming a slot in a tie bar connected to the paddle; and   molding an encapsulation through the slot.   
   
   
       3 . The system as claimed in  claim 1  further comprising:
 forming a recess in the lead body from a lead body top surface; and   molding an encapsulation in the recess.   
   
   
       4 . The system as claimed in  claim 1  further comprising:
 forming a recess in the lead body from a lead body top surface;   forming a slot in a tie bar connected to the paddle; and   molding an encapsulation through the slot and in the recess.   
   
   
       5 . The system as claimed in  claim 1  wherein filling the substantially electrically nonconductive material in the depression includes filling an adhesive in the depression. 
   
   
       6 . An integrated circuit package system comprising:
 forming a paddle, having a depression from a paddle top surface, and an external interconnect, with a tie bar attached to the paddle;   forming a lead tip and a lead body of the external interconnect with a lead tip bottom surface above a lead body bottom surface;   connecting an integrated circuit die over the paddle top surface and the external interconnect; and   filling a substantially electrically nonconductive material in the depression.   
   
   
       7 . The system as claimed in  claim 6  wherein connecting the integrated circuit die and the external interconnect includes attaching a solder bump between the integrated circuit die and the lead tip. 
   
   
       8 . The system as claimed in  claim 6  wherein connecting the integrated circuit die and the external interconnect includes attaching a bond wire between the integrated circuit die and the lead tip. 
   
   
       9 . The system as claimed in  claim 6  further comprising:
 forming a slot in the tie bar;   forming a hole in the lead tip; and   molding an encapsulation through the slot and the hole.   
   
   
       10 . The system as claimed in  claim 6  further comprising:
 forming a recess in the lead body from a lead body top surface;   forming a slot in the tie bar;   forming a hole in the lead tip; and   molding an encapsulation through the slot, through the hole, and in the recess.   
   
   
       11 . An integrated circuit package system comprising:
 a paddle having a depression from a paddle top surface;   an external interconnect having a lead tip and a lead body;   a device over the paddle top surface;   an internal interconnect between the device and the external interconnect; and   a substantially electrically nonconductive material in the depression.   
   
   
       12 . The system as claimed in  claim 11  further comprising a tie bar connected to the paddle has a slot with an encapsulation through the slot. 
   
   
       13 . The system as claimed in  claim 11  wherein the lead body has a recess from a lead body top surface with an encapsulation in the recess. 
   
   
       14 . The system as claimed in  claim 11  further comprising:
 a tie bar connected to the paddle has a slot with an encapsulation through the slot; and wherein:   the lead body has a recess from a lead body top surface with an encapsulation in the recess.   
   
   
       15 . The system as claimed in  claim 11  wherein the substantially electrically nonconductive material in the depression is an adhesive. 
   
   
       16 . The system as claimed in  claim 11  wherein:
 the paddle having the depression from the paddle top surface is connected to a tie bar;   the external interconnect having the lead tip and the lead body has a lead tip bottom surface above a lead body bottom surface;   the device over the paddle top surface is an integrated circuit die;   the internal interconnect between the device and the external interconnect is connected to the lead tip; and   the substantially electrically nonconductive material in the depression is on the paddle top surface.   
   
   
       17 . The system as claimed in  claim 16  wherein the internal interconnect is a solder bump. 
   
   
       18 . The system as claimed in  claim 16  wherein the internal interconnect is a bond wire. 
   
   
       19 . The system as claimed in  claim 16  wherein:
 the tie bar has a slot;   the lead tip has a hole; and further comprising:   an encapsulation through the slot and the hole.   
   
   
       20 . The system as claimed in  claim 16  wherein:
 the lead body has a recess from the lead body top surface;   the tie bar has a slot;   the lead tip has a hole; and further comprising:   an encapsulation in the slot, the hole, and the recess.