US2008067552A1PendingUtilityA1
Semiconductor integrated circuit device and method for desiging the same
Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO LTDPriority: Oct 26, 2001Filed: Oct 31, 2007Published: Mar 20, 2008
Est. expiryOct 26, 2021(expired)· nominal 20-yr term from priority
Inventors:Hiroyuki Yamauchi
G06F 2111/06G06F 30/30G06F 30/39G11C 11/412H10B 10/12H10B 10/00
54
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Claims
Abstract
A semiconductor integrated circuit device has a plurality of design patterns composed of circuit elements or wires formed on a substrate. The respective finished sizes of the plurality of design patterns have a plurality of minimum size values which differ from one design pattern to another depending on the geometric feature of each of the design patterns.
Claims
exact text as granted — not AI-modified1 - 16 . (canceled)
17 . A semiconductor integrated circuit device comprising:
a design pattern composed of a plurality of circuit elements or the wires formed on a substrate, the design pattern having a plurality of minimum size values in a spacing between parts at different potentials during standby which differ depending on an electric specification and a designing means for implementing the electric specification.
18 . The semiconductor integrated circuit device of claim 17 , wherein the parts at different potentials during standby are formed in different layers.
19 . The semiconductor integrated circuit device of claim 17 , wherein
the electric specification is suppression of a leakage current and the designing means includes at least one of power voltage control, power shutdown control, threshold voltage control, and gate-to-source potential control.
20 . The semiconductor integrated circuit device of claim 17 , wherein
the electric specification is an operating speed and the designing means includes at least one of power voltage control, threshold voltage control, and delay control effected by using variations in the number of wiring layers used in a layout.
21 . The semiconductor integrated circuit device of claim 17 , wherein
the electric specification is a timing value and the designing means includes at least one of selection of synchronous design or asynchronous design, delay control effected by using variations in the number of wiring layers used in a layout, a delay circuit for timing adjustment, a gate size of a transistor, and a layout for adjusting a distance from a clock driver.
22 . The semiconductor integrated circuit device of claim 17 , wherein
the circuit elements are memory elements and the designing means is a means for imparting a redundancy function for saving a defect.
23 - 41 . (canceled)
42 . A method for designing a semiconductor integrated circuit device, the method comprising the step of
forming, on a substrate, a plurality of design patterns composed of circuit elements or wires, wherein the plurality of design patterns include a spacing between parts at different potentials during standby and a plurality of design rules are applied to the plurality of design patterns depending on an electric specification of each of the design patterns and a designing method for implementing the electric specification.
43 . The method of claim 42 , wherein
the parts at different potentials during standby are formed in different layers.
44 . The method of claim 42 , wherein
the electric specification is suppression of a leakage current and the designing method includes at least one of power voltage control, power shutdown control, threshold voltage control, and gate-to-source potential control.
45 . The method of claim 42 , wherein
the electric specification is an operating speed and the designing method includes at least one of power voltage control, threshold voltage control, and delay control effected by using variations in the number of wiring layers used in a layout.
46 . The method of claim 42 , wherein
the electric specification is a timing value and the designing method includes at least one of selection of synchronous design or asynchronous design, delay control effected by using variations in the number of wiring layers used in a layout, a delay circuit for timing adjustment, a gate size of a transistor, and a layout for adjusting a distance from a clock driver.
47 . The method of claim 42 , wherein
the circuit elements are memory elements and the designing method is a method for imparting a redundancy function for saving a defect.
48 - 50 . (canceled)Join the waitlist — get patent alerts
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