Substrate holding apparatus and substrate polishing apparatus

Abstract

A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.

1 - 37 . (canceled)  
     
     
         38 . A retainer ring for use in a substrate polishing apparatus comprising: 
 an annular surface to be engaged with a polishing surface radially outside of a substrate when the substrate is brought into contact with the polishing surface for polishing of the substrate, the annular surface having radially outer and inner peripheral edges; and    a groove formed on the annular surface, said groove extending from the radially outer peripheral edge towards the radially inner peripheral edge, wherein the groove ends short of the radially inner peripheral edge.    
     
     
         39 . A retainer ring according to claim  1 , wherein a plurality of said grooves extending in a radial direction are formed on the annular surface.  
     
     
         40 . A retainer ring according to claim  1 , wherein a plurality of said grooves inclined at a predetermined angle relative to a radial direction are formed on the annular surface.