US2008063864A1PendingUtilityA1

Variable-thickness elecriplast moldable capsule and method of manufacture

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Assignee: AISENBREY THOMASPriority: Feb 15, 2001Filed: Nov 8, 2007Published: Mar 13, 2008
Est. expiryFeb 15, 2021(expired)· nominal 20-yr term from priority
Inventors:Thomas Aisenbrey
B29B 9/14B29K 2995/0005B29K 2995/0013D06M 15/19Y10T428/2913B29C 48/08B29C 48/06B29K 2105/0023B29C 48/154B29C 2793/009Y10T428/2933B29C 59/14
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Claims

Abstract

A moldable capsule device ( 1 ) includes a bundle of micron conductive fiber ( 3 ) and a resin-based material layer ( 5 ) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T 1 and T 2 ). A method ( 100 ) to form a moldable capsule ( 1 ) including extruding/pultruding a resin-based material layer ( 5 ) onto the length (L) of a bundle of micron conductive fiber ( 3 ). The resin-based material layer ( 5 ) has a first thickness (T 1 ) and a second thickness (T 2 ). The first thickness (T 1 ) is disposed around multiple first surfaces ( 7 ) of the bundle. The second thickness (T 2 ) is disposed around multiple second surfaces ( 9 ) of the bundle. The second thickness (T 2 ) is at least twice that of the first thickness (T 1 ). The extruded/pultruded resin-based material and bundle are section into moldable capsules.

Claims

exact text as granted — not AI-modified
1 . A moldable capsule device comprising: 
 a bundle of micron conductive fiber; and    a resin-based material layer overlying the bundle along the length of the capsule wherein thickness of the resin-based material layer is not uniform.    
     
     
         2 . The device according to  claim 1  wherein the resin-based material layer has a first thickness and a second thickness and wherein the second thickness is at least twice that of the first thickness.  
     
     
         3 . The device according to  claim 2  wherein the first thickness is disposed around a first surface of the bundle and the second thickness is disposed around a second surface of the bundle.  
     
     
         4 . The device according to  claim 2  wherein the first thickness is disposed around multiple first surfaces of the bundle and the second thickness is disposed around multiple second surfaces of the bundle.  
     
     
         5 . The device according to  claim 4  wherein the cross-section of the moldable capsule is “bowtie-shaped”.  
     
     
         6 . The device according to  claim 4  wherein the cross-section of the moldable capsule is “gear-shaped”.  
     
     
         7 . The device according to  claim 4  wherein the cross-section of the moldable capsule is “star-shaped”.  
     
     
         8 . The device of  claim 1  wherein the resin-based material further comprises a micron conductive powder.  
     
     
         9 . The device of  claim 1  wherein the bundle further comprises micron conductive powder.  
     
     
         10 . The device of  claim 1  wherein the bundle is between about 5% and 50% of the weight of the moldable capsule.  
     
     
         11 . The device of  claim 1  wherein the bundle is between about 20% and 50% of the weight of the moldable capsule.  
     
     
         12 . The device of  claim 1  wherein the bundle is between about 1% and 50% of the volume of the moldable capsule.  
     
     
         13 . The device of  claim 1  wherein the bundle is between about 4% and 10% of the weight of the moldable capsule.  
     
     
         14 . A moldable capsule device comprising: 
 a bundle of micron conductive fiber; and    a resin-based material layer overlying the bundle along the length of the capsule wherein the resin-based material layer has a first thickness and a second thickness, wherein the first thickness is disposed around multiple first surfaces of the bundle and the second thickness is disposed around multiple second surfaces of the bundle, and wherein the second thickness is at least twice that of the first thickness.    
     
     
         15 . The device according to  claim 14  wherein the cross-section of the moldable capsule is “bowtie-shaped”.  
     
     
         16 . The device according to  claim 14  wherein the cross-section of the moldable capsule is “gear-shaped”.  
     
     
         17 . The device according to  claim 14  wherein the cross-section of the moldable capsule is “star-shaped”.  
     
     
         18 . The device of  claim 14  wherein the resin-based material further comprises a micron conductive powder.  
     
     
         19 . The device of  claim 14  wherein the bundle further comprises micron conductive powder.  
     
     
         20 . The device of  claim 14  wherein the bundle is between about 5% and 50% of the weight of the moldable capsule.  
     
     
         21 . The device of  claim 14  wherein the bundle is between about 20% and 50% of the weight of the moldable capsule.  
     
     
         22 . The device of  claim 14  wherein the bundle is between about 1% and 50% of the volume of the moldable capsule.  
     
     
         23 . The device of  claim 14  wherein the bundle is between about 4% and 10% of the weight of the moldable capsule.  
     
     
         24 . A method to form a moldable capsule comprising: 
 extruding/pultruding a resin-based material layer onto the length of a bundle of micron conductive fiber wherein the resin-based material layer has a first thickness and a second thickness, wherein the first thickness is disposed around multiple first surfaces of the bundle and the second thickness is disposed around multiple second surfaces of the bundle, and wherein the second thickness is at least twice that of the first thickness; and    sectioning said extruded/pultruded resin-based material and said bundle into moldable capsules.    
     
     
         25 . The method according to  claim 24  wherein the cross-section of the moldable capsule is “bowtie-shaped”.  
     
     
         26 . The method according to  claim 24  wherein the cross-section of the moldable capsule is “gear-shaped”.  
     
     
         27 . The method according to  claim 24  wherein the cross-section of the moldable capsule is “star-shaped”.  
     
     
         28 . The method of  claim 24  wherein the resin-based material further comprises a micron conductive powder.  
     
     
         29 . The moldable capsule of  claim 24  wherein the bundle further comprises micron conductive powder.  
     
     
         30 . The method of  claim 24  wherein the bundle is between about 5% and 50% of the weight of the moldable capsule.  
     
     
         31 . The moldable capsule of  claim 1  wherein the bundle is between about 20% and 50% of the weight of the moldable capsule.  
     
     
         32 . The moldable capsule of  claim 24  wherein the bundle is between about 1% and 50% of the volume of the moldable capsule.  
     
     
         33 . The moldable capsule of  claim 24  wherein the bundle is between about 4% and 10% of the weight of the moldable capsule.  
     
     
         34 . The method according to  claim 24  further comprising the step of compressing the bundle of micron conductive fiber strands prior to the step of extruding/pultruding.  
     
     
         35 . The method according to  claim 24  further comprising the step of pre-treating said bundle prior to the step of extruding/pultruding.  
     
     
         36 . The method according to  claim 35  wherein the step of pre-treating comprises forming a chemically inert coupling agent onto the bundle.  
     
     
         37 . The method according to  claim 35  wherein the step of pre-treating comprises anodizing the bundle.

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