US2008061294A1PendingUtilityA1

Thin-film transistor substrate, display device, cad program and transfer method for thin-film transistor substrate

Assignee: TOSHIBA MATSUSHITA DISPLAY TECPriority: Mar 30, 2004Filed: Nov 8, 2007Published: Mar 13, 2008
Est. expiryMar 30, 2024(expired)· nominal 20-yr term from priority
A47K 10/02D06B 3/10H10D 86/441H10D 86/60H10D 86/0214
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Claims

Abstract

A thin-film transistor substrate includes a pixel region where gate electrode lines are arranged on an insulating substrate sandwiching semiconductor layer patterns and a gate insulator with the insulating substrate, wherein shapes of the semiconductor patterns and the gate electrode lines are set so that a value of K obtained by the following equation is smaller than a first set value when the thin-film transistor substrate is mounted on a metal table: K =( L/Ce )×{ Ca /( Ca+Cb )}× S where Ca represents a capacitor between each of the semiconductor layer patterns and the metal table, Cb represents a capacitor between each of the semiconductor layer patterns and the gate electrode lines, Ce represents a capacitor between each of the gate electrode lines and the metal table, L represents a length of each of the gate electrode line, and S represents a substrate surface area that one of the gate electrode lines are in charge of per unit length.

Claims

exact text as granted — not AI-modified
1 . A transfer method for a thin-film transistor substrate in which a pixel region and a driving circuit region are arrayed on an insulating substrate, the pixel region being configured by pixels including thin-film transistors, respectively, and the driving circuit region mounting driving circuits for driving the thin-film transistors, 
 wherein a substrate support portion provided in transfer means transfers the thin-film transistors while supporting the thin-film transistors at support points set on a bottom side of the thin-film transistor substrate and outside the pixel region.    
   
   
       2 . The transfer method for a thin-film transistor substrate according to  claim 1 , 
 wherein the plurality of the thin-film transistor substrates are mounted on a transfer board and the transfer board is transferred while being supported at support points set on a bottom side of the transfer board and outside the pixel regions.

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