US2008057687A1PendingUtilityA1
Selective area deposition and devices formed therefrom
Est. expirySep 1, 2026(~0.1 yrs left)· nominal 20-yr term from priority
C23C 16/453H01C 7/006C23C 16/042H01C 17/08H05K 3/143H01G 4/33
45
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Claims
Abstract
Patterned thin film layers ( 12 ) are applied to a substrate ( 10 ) surface by masking selective areas of a substrate surface, e.g., with a printed pattern ( 11 ) of a material such as an oil, and vapor-depositing thin film material. The masking material is subsequently removed.
Claims
exact text as granted — not AI-modified1 . A method of depositing a patterned thin film layer on a surface of a substrate comprising:
masking selected areas of substrate, and vapor depositing a thin film on said masked substrate, whereby said thin film deposits on said substrate only on unmasked areas of said substrate.
2 . The method of claim 1 wherein said masking material is removed after said thin film is deposited.
3 . The method of claim 1 wherein said masking material is a chemical that is printed on said substrate surface.
4 . The method of claim 1 wherein said thin film is formed of electrically conductive material.
5 . The method of claim 1 wherein said thin film is an electrically resistive material.
6 . The method of claim 1 wherein said thin film is a dielectric material.
7 . The method of claim 1 wherein said masking material is an oil.
8 . The method of claim 1 , further comprising the step of measuring a characteristic of said thin film during said vapor deposition, and terminating said vapor deposition when a desired value of said characteristic is reached.Join the waitlist — get patent alerts
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