Circuitized substrate with increased roughness conductive layer as part thereof

Abstract

A circuitized substrate with a conductive layer which assures enhanced adhesion of the layer to selected dielectric layers used to form the circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer.

1 . A circuitized substrate comprising: 
 a dielectric layer; and    a conductive circuit layer bonded to said dielectric layer, said conductive layer including a first metal layer of a first metal having at least one smooth side including a first roughness, a second metal layer of a second metal different than said first metal of said first metal layer, said second metal layer of said second metal being positioned on said at least one smooth side of said first metal layer of said first metal, a thin polymer layer on said second metal layer of said second metal, said conductive circuit layer including said first and second metal layers and said thin polymer layer having a roughness greater than said first roughness of said first metal layer of said first metal.    
     
     
         2 . The circuitized substrate of  claim 1  wherein said second layer of said second metal comprises at least two sub-layers, each of a different metal.  
     
     
         3 . The circuitized substrate of  claim 2  wherein a first of said sub-layers of said second metal layer of said second metal comprises chromium and a second of said sub-layers of said second metal layer of said second metal comprises zinc.  
     
     
         4 . The circuitized substrate of  claim 1  wherein said thin polymer layer on said second metal layer of said second metal comprises benzotriazole.