Semiconductor devices and manufacturing method therefor

Abstract

A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.

1 . A non-contact identification semiconductor device comprising: 
 a semiconductor chip including a receiving circuit adapted to receive an inquiry to the non-contact identification semiconductor device,    a memory adapted to store identification information of multiple bits and a sending circuit to send the identification information of multiple bits; and    an antenna coupled to said semiconductor chip and adapted to receive said identification information of multiple bits from said semiconductor chip and to transmit said identification information outside of said non-contact identification semiconductor device,    wherein a long side length of the semiconductor chip is not greater than 0.5 mm in a plane dimension.