US2008053692A1PendingUtilityA1

Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same

Assignee: NEC CORPPriority: Sep 4, 2002Filed: Nov 5, 2007Published: Mar 6, 2008
Est. expirySep 4, 2022(expired)· nominal 20-yr term from priority
H10W 90/754H10W 90/753H10W 44/231H10W 44/20H10W 72/00H01G 2/065H01P 3/088H05K 3/222H01P 3/085H05K 1/0237
50
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

To suppress electromagnetic waves leaking through a power distribution circuit provided on a printed wiring board or a semiconductor package, and to prevent a degradation of a waveform of a signal excited by a high-speed digital circuit. A metal 10 is provided which has a dielectric coating 20 on its surfaces and is shaped like a long plate with a valve action, and the valve metal is coated with a layer 30 of a conductive material via the dielectric coating 20 , so that a characteristic impedance viewed from an input terminal can be reduced over a wide band.

Claims

exact text as granted — not AI-modified
1 . A printed circuit board mounting member, comprising: 
 a low impedance line device having a laminated structure in which a dielectric coating having a dielectric loss is interposed between first and second conductors;    first electrode leading terminals which are disposed on both ends of one of the conductors to make connection to a printed circuit board; and    second electrode leading terminals for connecting both ends of a metal member for mounting the low impedance line device and the printed circuit board; wherein    the first electrode leading terminal includes a connecting member connected to the first conductor, a first leg member connected to a wire on the printed circuit board, and a first body member for connecting the connecting member and the leg member;    the connecting member and the first leg member include members on both ends in a longitudinal direction of the first body member to make connection almost perpendicularly to the first body member;    the second electrode leading terminal includes a second body member connected to the metal member and a second leg member connected to a wire on the printed circuit board;    the second body members are connected to an end on the same long side of both ends in a longitudinal direction of a mounting surface of the metal member; and    the second leg member is connected to the second body member almost in parallel with the mounting surface.    
   
   
       2 . The printed circuit board mounting member according to  claim 1 , wherein the first leg member and the second leg member in contact with the printed circuit board have a cross sectional area larger than a cross sectional area of the first body member and the second body member not coming into contact with the printed circuit board.  
   
   
       3 . The printed circuit board mounting member according to  claim 1 , wherein the low impedance line device is molded with resin.  
   
   
       4 . A printed circuit board mounting member, comprising: 
 a low impedance line device having a laminated structure in which a dielectric coating having a dielectric loss is interposed between first and second conductors;    first electrode leading terminals which are disposed on both ends of one of the conductors to make connection to a printed circuit board; and    second electrode leading terminals which are disposed on both ends of a metal member for mounting the low impedance line device to make connection to the printed circuit board; wherein    the first electrode leading terminal includes a connecting member connected to the first conductor, a first leg member connected to a wire on the printed circuit board, and a first body member for connecting the connecting member and the leg member;    members are provided on both ends in a longitudinal direction of the first body member to interpose the first body member between the connecting member and the first leg member and make connection almost perpendicularly to the first body member; and    the second electrode leading terminals have second leg members connected to an end on the same long side of both ends in a longitudinal direction of a mounting surface of the metal member almost in parallel with the mounting surface.    
   
   
       5 . A printed circuit board mounting member, comprising: 
 a low impedance line device having a laminated structure in which a dielectric coating having a dielectric loss is interposed between first and second conductors;    first electrode leading terminals which are disposed on both ends of one of the conductors to make connection to a printed circuit board; and    second electrode leading terminals which are disposed on both ends of a metal member for mounting the low impedance line device to make connection to the printed circuit board;    the first electrode leading terminal includes a connecting member connected to the first conductor, a first leg member connected to a wire on the printed circuit board, and a first body member for connecting the connecting member and the leg member;    the connecting member is connected almost perpendicularly to an end in a longitudinal direction of the first body member; and    the second electrode leading terminals have second body members connected to an end on the same long side of both ends in a longitudinal direction of a mounting surface of the metal member almost perpendicularly to the mounting surface.    
   
   
       6 . A printed circuit board mounting member, comprising: 
 a low impedance line device having a laminated structure in which a dielectric coating having a dielectric loss is interposed between first and second conductors;    first electrode leading terminals which are disposed on both ends of one of the conductors to make connection to a printed circuit board; and    second electrode leading terminals which are disposed on both ends of a metal member for mounting the low impedance line device to make connection to the printed circuit board; wherein    the first electrode leading terminal includes a connecting member connected to the first conductor, a first leg member connected to a wire on the printed circuit board, and a first body member for connecting the connecting member and the leg member;    the connecting member is connected almost perpendicularly to an end in a longitudinal direction of the first body member;    the second electrode leading terminal has a second body member connected almost to a center of a short side of both ends in a longitudinal direction of a mounting surface of the metal member almost perpendicularly to the short side; and    the first electrode leading terminal and the second electrode leading terminal are disposed almost in line with each other in the longitudinal direction of the mounting surface.    
   
   
       7 . A printed circuit board having a metal which has a valve action, a dielectric coating formed on a surface of the metal having the valve action, a conductive material layer formed around the metal having the valve action via the dielectric coating, and a metal member for transmitting direct-current power to be inputted, comprising: 
 a stripline device having first and second input/output terminals on both ends of the metal having the valve action and both ends of the metal member;    a board; and    a first power supply wire and a second power supply wire formed on the board;    wherein the first power supply wire and the second power supply wire are connected to the first and second input/output terminals, respectively.    
   
   
       8 . The printed circuit board according to  claim 7 , wherein circuit elements for receiving power of an equal voltage are disposed on the printed circuit board in an integrated manner, and an equal power is supplied by a bus bar.  
   
   
       9 . A semiconductor package comprising the printed circuit board of  claim 7 , wherein, 
 the board is a substrate made of an insulating material,    a semiconductor chip is mounted on the substrate,    the substrate has a first connector pin and a second connector pin which are connected to the device mounted on the board,    the semiconductor chip has the first power supply wire and the second power supply wire, and    the first and second input/output terminals are connected to the connector pins of the substrate and the power supply wires of the semiconductor chip, respectively.

Join the waitlist — get patent alerts

Track US2008053692A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.