Solid-state imaging device, camera module, and camera-module manufacturing method

Abstract

A cover glass covers only light-receiving elements formed on a semiconductor substrate of a solid-state imaging device. The other area of the substrate except the light-receiving elements is exposed. An FPC interposed between an optical unit and the solid-state imaging device is formed with an opening for exposing the cover glass and an assembly reference surface of the solid-state imaging device. When the solid-state imaging device is attached to the optical unit, the center of the light-receiving elements is determined as a reference position. The optical unit is directly attached to the assembly reference surface so as to make the reference position coincide with a photographic optical axis of the optical unit.

1 . A manufacturing method for a camera module including a solid-state imaging device in which light-receiving elements are formed on a semiconductor substrate, and an optical unit having a built-in photographic optical system for forming a subject image on said light-receiving elements, said manufacturing method comprising the steps of: 
 obtaining image data by imaging said solid-state imaging device with an electronic camera;    determining a first reference position of said solid-state imaging device from said image data;    carrying out positioning on a plane perpendicular to a photographic optical axis of said optical unit so as to make said first reference position coincide with a predetermined second reference position of said optical unit; and    fixing said solid-state imaging device to said optical unit.    
   
   
       2 . A manufacturing method for a camera module according to  claim 1 , wherein said first reference position is located at the center of a light-receiving area of said light-receiving elements.  
   
   
       3 . A manufacturing method for a camera module according to  claim 2 , wherein said second reference position is located at said photographic optical axis of said optical unit.  
   
   
       4 . A manufacturing method for a camera module according to  claim 1 , wherein said solid-state imaging device comprising: 
 a translucent member attached to a first surface of the semiconductor substrate on which said light-receiving elements are formed, said translucent member covering only the light-receiving elements;    an external connection terminal formed on a second surface of said semiconductor substrate, said second surface being opposite to said first surface; and    a wiring member for electrically connecting said light-receiving element and said external connection terminal.    
   
   
       5 . A manufacturing method for a camera module according to  claim 4 , wherein said first surface of said semiconductor substrate is used as an assembly reference plane when said solid-state imaging device is fixed to said optical unit.  
   
   
       6 . A manufacturing method for a camera module according to  claim 5 , wherein said optical unit is directly attached to said first surface.  
   
   
       7 . A manufacturing method for a camera module according to  claim 5 , wherein said translucent member has flatness being identical with that of said semiconductor substrate.  
   
   
       8 . A manufacturing method for a camera module according to  claim 7 , wherein said optical unit is attached to said translucent member.