Cooling structure for electronics and machines

Abstract

The invention relates to an improved cooling structure for electronics and machines, which produce heat during working and have been provided with cooling fins or grid. A nanocarbon layer is covered on IC boards, CPUs, and the cooling fins or grids, that facilitates the cooling effect obviously because of increased surface area. Hence, the working electronics and machines can be cooled more conveniently and effectively and input energy will be also saved.

1 . An improved cooling structure for electronics and machines provided with cooling fins or grid thereon, and the character is to provide a nanocarbon layer on the cooling fins or grid, in which the nanocarbon layer is composed of a lot of nanocarbon particles.  
   
   
       2 . The improved cooling structure for electronics and machines as claimed in  claim 1 , wherein the nanocarbon particles are covered on the cooling fins or grid with tiny gaps by flux and adherence.  
   
   
       3 . The improved cooling structure for electronics and machines as claimed in  claim 1 , wherein the nanocarbon layer is covered on an IC board, a radiator, and fins of a LED assembly.  
   
   
       4 . The improved cooling structure for electronics and machines as claimed in  claim 1 , wherein the nanocarbon layer is covered on a CPU, its connected radiator, and fins of a computer.