US2008041560A1PendingUtilityA1

Diamond heat sink

Individually held — no corporate assignee on recordPriority: Apr 2, 2002Filed: Jun 11, 2007Published: Feb 21, 2008
Est. expiryApr 2, 2022(expired)· nominal 20-yr term from priority
H10W 72/07336H10W 72/352H10W 72/073H10W 40/254H10W 40/47H10W 72/30H01S 5/4025F28D 2021/0029F28F 21/02F28F 3/04H01S 5/02484F28F 2260/02H01S 5/02423
46
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Claims

Abstract

A heat sink made of a natural or polycrystalline diamond substrate with fins formed thereon. Diamond is grown to form a substrate and a laser is used to cut channels in the substrate to form the fins.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a diamond heat sink, the method comprising: 
 growing diamond to form a substrate; and    using a laser to cut channels in the substrate to form fins thereon.    
     
     
         2 . The method of  claim 1  further including growing multiple diamond layers and securing the multiple diamond layers together to form a substrate with discrete layers before the channels are cut.  
     
     
         3 . The method of  claim 2  in which cutting includes cutting channels in all the layers.  
     
     
         4 . The method of  claim 2  in which cutting includes cutting channels in a subset of the layers.  
     
     
         5 . The method of  claim 1  in which growing includes chemical-vapor-deposition of diamond.  
     
     
         6 . The method of  claim 1  in which the channels are cut to be 150 um or less in width to form microchannels.  
     
     
         7 . The method of  claim 1  in which the channels are cut to extend in one direction to form straight fins.  
     
     
         8 . The method of  claim 1  in which the channels are cut to extend in two different directions to form pin fins.  
     
     
         9 . The method of  claim 1  further including the addition of a metalization layer to the substrate.  
     
     
         10 . The method of  claim 1  in which the substrate is polished before it is cut.  
     
     
         11 . A heat sink assembly comprising: 
 a natural or polycrystalline diamond substrate with fins formed thereon; and    a natural or polycrystalline diamond support attached to the substrate.    
     
     
         12 . The heat sink of  claim 11  in which the diamond is chemical-vapor-deposited diamond or diamond-like-carbon.  
     
     
         13 . The heat sink assembly of  claim 11  in which the fins extend continuously along the substrate.  
     
     
         14 . The heat sink assembly of  claim 11  in which the fins are pin fins.  
     
     
         15 . The heat sink assembly of  claim 11  in which the substrate and the fins are monolithic.  
     
     
         16 . The heat sink assembly of  claim 11  in which the substrate has a plurality of layers.  
     
     
         17 . The heat sink assembly of  claim 16  in which the fins are cut in all of the layers.  
     
     
         18 . The heat sink assembly of  claim 16  in which the fins are cut in a subset of all the layers.  
     
     
         19 . The heat sink assembly of  claim 11  in which the fins form microchannels in the substrate.  
     
     
         20 . The heat sink assembly of  claim 11  in which the substrate has opposing top and bottom planar surfaces, and the fins are formed in one said planar surface.  
     
     
         21 . The heat sink assembly of  claim 11  further including metalization on the support and metalization on the substrate.  
     
     
         22 . The heat sink assembly of  claim 11  further including a heat source mounted on the support.  
     
     
         23 . The heat sink assembly of  claim 22  further including metalization on the heat source.  
     
     
         24 . An optical device comprising: 
 a reflective surface; and    a heat sink adjacent the optical surface, the heat sink including a natural or polycrystalline diamond substrate with fins formed thereon.    
     
     
         25 . A window comprising: 
 a natural or a polycrystalline diamond substrate with upper and lower surfaces; and    fins formed in at least one edge of the substrate.    
     
     
         26 . An integrated cooling system comprising: 
 an integrated electronic or optical device; and    a natural or polycrystalline diamond substrate mated on one surface with the device and including fins formed on the substrate for cooling the device.

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