US2008038877A1PendingUtilityA1

Light-Weight Flash Hard Drive With Plastic Frame

Assignee: SUPER TALENT ELECTRONICS INCPriority: Nov 16, 2004Filed: Oct 15, 2007Published: Feb 14, 2008
Est. expiryNov 16, 2024(expired)· nominal 20-yr term from priority
G07C 9/257G06K 19/07354G06F 21/32G06K 19/07G06F 21/78G06F 12/1416H05K 5/0269Y10T29/49128H05K 5/026G06V 40/1365
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Claims

Abstract

A light-weight flash hard drive includes a printed circuit board assembly (PCBA) mounted in a housing formed by a plastic frame and a pair of metal panels that are mounted on the plastic frame over the PCBA. The PCBA includes a PC board and a plug connector that is mounted on a front edge of the PCB. The plastic frame includes first and second parallel side rails and a back end rail extending between back ends of the first and second side rails. The frame defines an open front end and a longitudinal platform for receiving and supporting the PCBA such that the plug connector is exposed through the open front end. The metal panels are either snap-coupled to the plastic frame or to each other. Alternatively, or in addition, an adhesive or insulating film is provided between the metal panels and the IC devices mounted on the PCBA.

Claims

exact text as granted — not AI-modified
1 . A method for manufacturing a flash hard drive comprising: 
 forming a printed circuit board assembly (PCBA) including a plurality of integrated circuit (IC) devices, a plastic frame, and first and second metal panels;    mounting the PCBA inside of the plastic frame;    applying an adhesive to one of: (a) an upper surface of each of the plurality of IC devices, and (b) an inside surface of each of the first and second metal panels; and    mounting the first and second metal panels onto the plastic frame such that the upper surface of each of the plurality of IC devices contacts the inside surface of an associated one of the first and second metal panels by way of the adhesive.    
   
   
       2 . The method according to  claim 1 , wherein mounting the first and second metal panels further comprises: 
 mounting the plastic frame, the PCBA, and the first and second metal panels into a fixture such that the inside surface of each of the first and second metal panels is pressed against the upper surface of the associated IC devices with the adhesive pressed therebetween;    heating the fixture to a first relatively high temperature; and    cooling the fixture to a second, relatively low temperature.    
   
   
       3 . The method according to  claim 2 , wherein the adhesive comprises a heat-activated adhesive material exhibiting a first, relatively low adherence prior to being heated to the first, relatively high temperature, and exhibiting a second, relatively high adherence when subsequently cooled to the second, relatively low temperature.  
   
   
       4 . The method according to  claim 1 , wherein the adhesive comprises a heat-cured adhesive material exhibiting an initial, relatively low adherence when applied, and exhibiting a second, relatively high adherence when heated to the first, relatively high temperature, and then subsequently cooled to the second, relatively low temperature.  
   
   
       5 . The method according to  claim 1 , wherein mounting the first and second metal panels further comprises inserting connection fingers extending from outer edges of the first and second metal panels into engagement holes formed in the plastic frame.

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