Processing method, manufacturing method of semiconductor device, and processing apparatus

Abstract

A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.

1 - 40 . (canceled)  
     
     
         41 . A processing apparatus for selectively exposing a whole region to be exposed with energy ray in the film formed on a substrate, comprising: 
 a substrate hold portion which holds the substrate;    a ray source which generates an energy ray to selectively reduce or remove the whole region to be exposed with energy ray;    a shaping portion which is disposed on an optical axis of the energy ray and which shapes the shape of the energy ray generated by the ray source;    a scan portion which relatively scans the energy ray shaped by the shaping portion against the whole region to be exposed with the energy ray on the substrate; and    a solution supply portion which changes a flow direction of a solution in accordance with direction of a solution in accordance with a scan direction of the energy ray by the scan portion, and continuously supply the solution to the surface of the whole region to be exposed with the energy ray on the substrate.    
     
     
         42 . The processing apparatus according to  claim 41 , wherein the shaping portion shapes the ray from the ray source so that the rays having the same shape are periodically arranged in the scan direction on the substrate.  
     
     
         43 .- 47 . (canceled)  
     
     
         48 . The processing apparatus according to  claim 41 , wherein the solution supply portion further comprises: 
 a holder fixed the substrate disposed on the substrate hold portion;    a first pipe connected to the holder;    a second pipe connected to the holder so that the substrate is held between the first and second pipes; and    a solution supply unit which supplies the solution on the substrate from one pipe in accordance with a scan direction of the energy ray and which discharges the solution supplied on the substrate via the other pipe.    
     
     
         49 . The processing apparatus according to  claim 41 , wherein the solution supply portion further comprises: 
 a flowing liquid supply unit comprising a spout port which spouts the solution and a discharge port disposed opposite to the spout port; and    a rotation portion which rotates the flowing liquid supply unit in a plane of the substrate.    
     
     
         50 . (canceled)  
     
     
         51 . A processing apparatus for selectively exposing a whole region to be exposed with energy ray in the film formed on a substrate, comprising. 
 a substrate hold portion which holds the substrate;    a ray source which generates an energy ray to selectively reduce or remove whole region to be exposed with energy ray in the film;    a shaping portion which is disposed on an optical axis of the energy ray and which shapes the energy ray generated by the ray source and which exposure energy rays arranged a designed period; and    a scan portion which relatively scans the energy ray against the whole region to be exposed with the energy ray in the period or less.    
     
     
         52 .- 53 . (canceled)  
     
     
         54 . The processing apparatus according to  claim 51 , further comprising: an observation system which observes the surface of the whole region to be exposed of the substrate during processing.  
     
     
         55 . The processing apparatus according to  claim 54 , further comprising: an inspection portion which recognizes a processing abnormality from a gradation change of an observed image observed by the observation system.  
     
     
         56 . The processing apparatus according to  claim 54 , further comprising: an exposure amount control unit which recognizes a distribution of progress of processing in the whole region to be exposed from the observed image observed by the observation system and which controls an energy amount of the energy ray exposing each exposing unit region.  
     
     
         57 . The processing apparatus according to  claim 51 , further comprising: a solution supply portion which changes a flow direction of the solution in accordance with a scan direction of the energy ray by the scan portion, continuously supply the solution onto the surface of the whole region to be exposed on the substrate.  
     
     
         58 . The processing apparatus according to  claim 57 , wherein the solution supply portion further comprises: 
 a holder fixed the substrate disposed on the substrate hold portion;    a first pipe connected to the holder;    a second pipe connected to the holder so that the substrate is held between the first and second pipes; and    a solution supply unit which supplies the solution onto the substrate disposed in the holder from one pipe in accordance with a scan direction of the energy ray and which discharges the solution supplied onto the substrate via the other pipe.    
     
     
         59 . The processing apparatus according to  claim 57 , wherein the solution supply portion further comprises: 
 a flowing liquid supply unit comprising a spout port which spouts the solution and a discharge port disposed opposite to the spout port; and    a rotation portion which rotates the flowing liquid supply unit in a plane of the substrate.    
     
     
         60 . The processing apparatus according to  claim 51 , further comprising: a forming portion which is formed the film to be processed on a main surface of the substrate.  
     
     
         61 . A processing apparatus comprising: 
 a hold portion which holds a substrate;    an exposure portion which generates an energy ray to remove or reduce the whole region to be exposed with energy ray in the film;    an observation/measurement portion which observes a gas member generated by exposure with the energy ray above the exposure region; and    a control portion which controls an exposure timing of the energy ray exposed from the exposure portion from an observation/measurement result of the observation/measurement portion.    
     
     
         62 . The processing apparatus according to  claim 61 , wherein the observation/measurement portion measures a size of the gas member, and exposures the energy ray from the exposure portion, when the measured size is smaller than a predetermined value or when there is no gas member.  
     
     
         63 . The processing apparatus according to  claim 62 , wherein the observation/measurement portion comprises: 
 an observation portion which acquires an image of an exposure region; and    a measurement portion which measures the size of the gas member from a gradation change of the image acquired by the observation portion.    
     
     
         64 .- 65 . (canceled)  
     
     
         66 . The processing apparatus according to  claim 61 , further comprising: 
 an observation portion which acquires an image of an exposure region; and    a control portion which judges presence/absence of residues of the film in the whole region to be exposed from the image acquired by the observation portion, and control the exposure of the energy ray from the result.    
     
     
         67 . The processing apparatus according to  claim 61 , further comprising: a shaping portion shapes the energy ray and which exposures a plurality of positions periodically arranged on the substrate with the energy ray.  
     
     
         68 . (canceled)  
     
     
         69 . A processing apparatus for selectively exposing a whole region to be exposed with energy ray in the film formed on a substrate, comprising: 
 a hold portion which holds the substrate;    an exposure portion which exposures each exposure unit region in the whole region to be exposed with an energy ray having an oscillation frequency Z (1/sec) and width W (μm) of one direction of an exposure region in the film to be processed;    a supply portion which supplies a solution onto the whole region to be exposed of the film to be exposed in one direction at a flow velocity V; and    a control portion which controls any one of the oscillation frequency Z, width W, and flow velocity V so as to satisfy the following relation:            V   ≥     6   ×       W   2       ×     z   .               
     
     
         70 .- 71 . (canceled)  
     
     
         72 . The processing apparatus according to  claim 69 , further comprising: 
 an observation portion which acquires an image of an exposure region; and    a control portion which judges presence/absence of residues of the film in the whole region to be exposed from the image acquired by the observation portion, and control the exposure of the energy ray from the result.    
     
     
         73 . The processing apparatus according to  claim 69 , further comprising: a shaping portion shapes the energy ray and which exposures a plurality of positions periodically arranged on the substrate with the energy ray.  
     
     
         74 . (canceled)  
     
     
         75 . A processing apparatus for selectively removing or reducing a whole region to be exposed with energy ray in the film formed on a substrate, comprising: 
 a hold portion which holds the substrate;    an exposure portion which exposes the substrate with an energy ray whose exposure region on the substrate is smaller than the whole region to be exposed at an oscillation frequency f (1/sec) and energy density per pulse so that the organic film can be removed;    a scan portion which relatively scans an exposure region of the energy ray against the whole region to be exposed on the substrate at a speed v (μm/sec); and    a control portion to control at least one of the exposure portion and scan portion so that the oscillation frequency f and speed v satisfy the following relation:              6.0   ×     10     -   5         ≤     v     f   2       ≤     1.0   ×       10     -   3       .               
     
     
         76 . The processing apparatus according to  claim 75 , wherein a width of the exposure region, whose direction is parallel to the scan direction of the exposure region of the energy ray, is not less than 2 μm and not more than 20 μm.  
     
     
         77 . (canceled)  
     
     
         78 . The processing apparatus according to  claim 75 , further comprising: a solution supply unit which supplies a solution onto a whole region to be exposed on the substrate.  
     
     
         79 . The processing apparatus according to  claim 75 , further comprising: 
 an observation portion which acquires an image of an exposure region; and    a control portion which judges presence/absence of residues of the film in the whole region to be exposed from the image acquired by the observation portion, and control the exposure of the energy ray from the result.    
     
     
         80 . The processing apparatus according to  claim 75 , further comprising: a shaping portion shapes the energy ray and which exposures a plurality of positions periodically arranged on the substrate with the energy ray.  
     
     
         81 .- 108 . (canceled)