US2008035485A1PendingUtilityA1
Apparatus for Manufacturing Biochip and Method for Manufacturing Biochip Tip Array Module
Est. expiryAug 8, 2026(~0 yrs left)· nominal 20-yr term from priority
Inventors:Chia-Tai Chen
C25D 1/00C25D 1/10
50
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Claims
Abstract
An apparatus of manufacturing a biochip and manufacture method of biochip tip array. The invention provides an apparatus for manufacturing a biochip from a substrate. The apparatus comprises a tip array, a reservoir tank and a conduit connecting the tip array and the reservoir tank. When the substrate is placed over the tip array, the agent in the reservoir tank can be applied to the substrate by moving upward and downward the reservoir tank with respect to the tip array.
Claims
exact text as granted — not AI-modified1 . An apparatus for manufacturing a biochip from a substrate, comprising:
a tip; a reservoir tank; and a conduit connecting the tip and the reservoir tank, when the substrate is paced over the tip, an agent in the reservoir tank can be applied to the substrate by moving upward and downward the reservoir tank with respect to the tip array.
2 . The apparatus as claimed in claim 1 , wherein the tip is disposed on a tip array substrate.
3 . he apparatus as claimed in claim 2 , wherein the tip array substrate comprises a plurality of tips arranged in an array.
4 . The apparatus as claimed in claim 1 , wherein electroforming or machining forms the tip.
5 . The apparatus as claimed in claim 1 , wherein the tip comprises metal, ceramic, or polymer.
6 . The apparatus as claimed in claim 1 , wherein electroforming or machining forms the reservoir tank.
7 . The apparatus as claimed in claim 1 , wherein the reservoir tank is comprises metal, ceramic, or polymer.
8 . The apparatus as claimed in claim 1 , wherein the reservoir tank comprises a reservoir plate with a plurality of cavities storing various agents.
9 . The apparatus as claimed in claim 1 , wherein the reservoir tank is moved upward to be located at a higher elevation with respect to the tip.
10 . The apparatus as claimed in claim 1 , wherein the inner diameter of the reservoir tank is the same as the conduit.
11 . The apparatus as claimed in claim 1 , wherein the reservoir tank and the conduit have different inner diameters.
12 . An apparatus of manufacturing a biochip from a substrate, comprising:
a tip array; a reservoir tank for storing an agent; a conduit connecting the tip and the reservoir tan; and a pressure controller connecting to and controlling the pressure of the reservoir.
13 . The apparatus as claimed in claim 12 , wherein the tip array substrate comprises a plurality of tips arranged in an array.
14 . The apparatus as claimed in claim 13 , wherein electroforming or machining forms the tip.
15 . The apparatus as claimed in claim 12 , wherein the tip comprises metal, ceramic, or polymer.
16 . The apparatus as claimed in claim 12 , wherein electroforming or machining forms the reservoir tank.
17 . The apparatus as claimed in claim 12 , wherein the reservoir tank is made of metal, ceramic, or polymer.
18 . The apparatus as claimed in claim 12 , wherein the reservoir tank comprises a reservoir plate with a plurality of cavities storing various agents.
19 . The apparatus as claimed in claim 12 , wherein the inner diameter of the reservoir tank is the same as the conduit.
20 . The apparatus as claimed in claim 12 , wherein the reservoir tank and the conduit have different inner diameters.
21 . The apparatus as claimed in claim 12 , wherein the pressure controller adjusts the agent location of the tip.
22 . A method for manufacturing a biochip tip array module, comprising:
providing a substrate; forming a photoresist layer on the substrate; subjecting a first exposure to the photoresist layer with a first photo-mask; subjecting a second exposure to the photoresist layer with a second photo-mask; developing the substrate to form a photoresist pattern thereon, wherein the photoresist pattern has a plurality of photoresist pillars arranged in an array; forming a metal layer on the substrate outside the photoresist pillars to form a metal structure; and removing the photoresist pillars and the substrate to leave the metal structure to form a tip array module, wherein the tip array module comprises a plurality of tips arranged in an array.
23 . The method as claimed in claim 22 , wherein the substrate comprises Si, Ge, Cu or combinations thereof.
24 . The method as claimed in claim 22 , wherein the metal layer comprises Ni, Co, Au, or combinations thereof.
25 . The method as claimed in claim 22 , wherein the metal layer is formed by electroplating, depositing or machining.Join the waitlist — get patent alerts
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