Apparatus for reducing contaminants from a chemical mechanical polishing pad

Abstract

The present invention provides an apparatus for reducing contaminants on an unused chemical mechanical polishing pad. The apparatus comprises a rotating vacuum platen for rotating and holding the polishing pad, a traversing arm that moves between a peripheral edge and a center axis of the polishing pad, and a contaminant collection nozzle movably disposed along a length of the traveling arm for collecting contaminants from the polishing pad. Further, the apparatus comprises a vacuum pump for providing a vacuum to the rotating vacuum platen and the contaminant collection nozzle.

1 . A method for expelling and collecting debris from a surface of a chemical mechanical polishing pad, comprising:
 introducing debris to the surface of the chemical mechanical polishing pad during manufacture;   providing an air blast nozzle;   providing a contaminant collection nozzle;   expelling the debris from the surface of the chemical mechanical polishing pad;   wherein the air blast nozzle and the contaminant collection nozzle work in conjunction to expel and collect the debris.   
   
   
       2 . The method of  claim 1 , wherein the debris are introduced to the polishing pad during manufacture of the polishing pad. 
   
   
       3 . The method of  claim 1 , wherein the debris are introduced to the polishing pad during grooving of the polishing pad. 
   
   
       4 . The method of  claim 1 , wherein the air blast nozzle delivers air at a pressure between 35 and 620 kPa. 
   
   
       5 . The method of  claim 1 , wherein the contaminant collection nozzle collects debris with a vacuum of between 3.7 to 4.7 kPa. 
   
   
       6 . The method of  claim 1 , further comprising:
 providing a vacuum platen;   holding the chemical mechanical polishing pad on the vacuum platen with vacuum;   rotating the vacuum platen and the chemical mechanical polishing pad; and,   sweeping the air blast nozzle and contaminant collection nozzle from a center of the chemical mechanical polishing pad to a peripheral edge of the chemical mechanical polishing pad.   
   
   
       7 . The method of  claim 6 , wherein the debris are introduced to the polishing pad during manufacture of the polishing pad. 
   
   
       8 . The method of  claim 6 , wherein the debris are introduced to the polishing pad during grooving of the polishing pad. 
   
   
       9 . The method of  claim 6 , wherein the vacuum platen is rotated at a speed between 150 and 850 rpm. 
   
   
       10 . The method of  claim 1 , wherein the air blast nozzle delivers air at a pressure between 35 and 620 kPa; and, wherein the contaminant collection nozzle collects debris with a vacuum of between 3.7 to 4.7 kPa.