US2008017186A1PendingUtilityA1

Heat collecting device

Assignee: LUO CHIN-KUANGPriority: Jul 13, 2006Filed: Jul 13, 2006Published: Jan 24, 2008
Est. expiryJul 13, 2026(expired)· nominal 20-yr term from priority
Inventors:Chin-Kuang Luo
F24S 80/60Y02E10/44F24S 10/45F24S 60/30F28F 13/00
54
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A heat collecting device includes: a first vacuum device which includes a first housing and which defines a first vacuum chamber; a second vacuum device which includes a second housing that contains the first vacuum device and which cooperates with the first vacuum device to define a second vacuum chamber therebetween; a metal plate mounted within the first vacuum device and having a plate body and an extension portion extending from the plate body to project outwardly of the first and second vacuum devices, the metal plate being capable of absorbing heat energy from an external heat source through the first and second vacuum devices; an insulating layer enclosing the extension portion; and a thermoelectric semiconductor device attached to the extension portion of the metal plate, extending through the insulating layer, and disposed outside the second vacuum device for conducting the heat energy absorbed by the metal plate.

Claims

exact text as granted — not AI-modified
1 . A heat collecting device, comprising:
 a first vacuum device which includes a first housing and which defines a first vacuum chamber;   a second vacuum device which includes a second housing that contains said first vacuum device and which cooperates with said first vacuum device to define a second vacuum chamber therebetween;   a metal plate mounted within said first vacuum device and having a plate body and an extension portion extending from said plate body to project outwardly of said first and second vacuum devices, said metal plate being capable of absorbing heat energy from an external heat source through said first and second vacuum devices;   an insulating layer enclosing said extension portion of said metal plate; and   a thermoelectric semiconductor device attached to said extension portion of said metal plate, extending through said insulating layer and disposed outside said second vacuum device for conducting the heat energy absorbed by said metal plate.   
   
   
       2 . The heat collecting device according to  claim 1 , wherein said metal plate is formed from a material selected from the group consisting of copper and aluminum. 
   
   
       3 . The heat collecting device according to  claim 1 , wherein said metal plate has an outer surface that is coated with a black paint material. 
   
   
       4 . The heat collecting device according to  claim 1 , wherein each of said first and second housings is a rectangular housing, said first and second housings having confronting walls that are made of glass.

Join the waitlist — get patent alerts

Track US2008017186A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.