Large area flat image sensor assembly

Abstract

A low temperature method for producing a substantially flat large area image sensor assembly, the method includes the steps of providing a die attach substrate having a substantially planar surface; providing a lead frame having a bonding surface and a plurality of leads extending there from; adhering an imager die to the substantially planar surface of the die attach substrate with a low curing temperature first adhesive; and adhering the die attach substrate with adhered imager die to a bonding surface of the lead frame with a low curing temperature second adhesive for producing an image sensor assembly.

1 . A large area flat image sensor assembly comprising: 
 (a) a die attach substrate having a substantially planar surface;    (b) an imager die adhered to the substrate and having an active surface dimensions of substantially 35 by 35 mm or greater and a deviation from flatness of the active imager surface of less than substantially 10 microns.    
   
   
       2 . The large area flat image sensor as in  claim 1  further comprising a die attach substrate composed of aluminum nitride.  
   
   
       3 . The large area flat image sensor as in  claim 1  further comprising a double side lap polished die attach substrate with a surface flatness of less than 2 microns total indicated run-out.  
   
   
       4 . The large area flat image sensor as in  claim 1  further comprising a first adhesive layer containing beads.  
   
   
       5 . The large area flat image sensor as in  claim 1  wherein a z height of the bonded imager die varies by less than 15 microns with respect to the second surface of the die attach substrate.