US2008003376A1PendingUtilityA1
Nitriding Method for Improving Surface Characteristics of Cobalt-Chromium Based Alloys
Est. expiryJan 30, 2024(expired)· nominal 20-yr term from priority
Inventors:Hubert Patrovsky
C23C 26/00C23C 8/20C23C 8/24C23C 8/36
45
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Claims
Abstract
A method for improving the surface characteristics of Cobalt chromium alloys by plasma nitriding. By creating a glow discharge around the parts with selective gases at partial pressures a compound layer is formed at the surface beneficial for wear applications. A further benefit is an increase in the load bearing capacity of the surface as compared to standard material.
Claims
exact text as granted — not AI-modified1 . A method for enhancing the surface hardness and smoothness of cobalt-chromium alloys through exposure in a reaction vessel to a mixture of reaction gases at a partial pressure (less than atmospheric) within a temperature range of 250° C. to 1000° C. for process time sufficient to create a substantial compound layer.
2 . The method of claim 1 wherein the reaction vessel utilizes a pulse plasma glow discharge as a media for the reaction.
3 . The method of claim 1 wherein the total pressure of reaction gases is 0.5 to 100 mbars.
4 . The method of claim 1 where the temperature is 400° C. to 600° C.
5 . The method of claim 1 wherein the reaction gases are Ar, N 2 , H 2 .
6 . The method of claim 3 wherein the reaction gases are Ar, N 2 , H 2 .
7 . The method of claim 1 wherein the reaction gases are Ar, N 2 , H 2 , CH 4 .
8 . The method of claim 3 wherein the reaction gases are Ar, N 2 , H 2 , CH 4 .
9 . The method of claim 1 wherein the reaction time is 6-42 hours
10 . The method of claim 1 wherein the reaction the reaction time is approximately 24 hours.
11 . The method of claim 1 where the pulse pause ratio is 1:0 to 1:50.
12 . The method of claim 3 where the pulse pause ration is 5:1 to 1:20.
13 . The method in claim 1 in which the identified hardened surface contains a compound layer of Cr—N of 1 to 20 microns thickness.
14 . The method in claim 1 in which the identified hardened surface contains a compound layer of Cr—N of 3 to 15 microns thickness.
15 . A method for enhancing the surface hardness and smoothness of a cobalt chromium material and with surface hardness and smoothness improved through exposure in a reaction vessel to a mixture of reaction gases (Ar, N 2 , H 2 , CH 4 ) for process time sufficient to create a compound layer substantially comprised of chromium nitrides.
16 . The method of claim 15 wherein the reaction gases are Ar, N 2 , H 2 .
17 . The method of claim 15 wherein the reaction gases are Ar, N 2 , H 2 , CH 4 .
18 . The method of claim 15 wherein the said material is ASTM F-75 and ASTM F-75 Modified alloy
19 . The method of claim 15 wherein the process temperature is held between 400° C. to 600° C.
20 . The method of claim 15 wherein the process partial pressure is held at less than atmospheric.
21 . The method of claim 15 wherein the process partial pressure is held at approximately 1-10 mbars.
22 . The method of claim 15 wherein the said cobalt chromium alloy is ASTM F-799, F75, and F75 modified.
23 . A method for enhancing the surface hardness and smoothness of a cobalt chromium molybdenum base material and with surface hardness and smoothness improved through exposure in a reaction vessel incorporating pulse plasma of reaction gases varies in on-to-off process levels.
24 . The method of 15 and 24 where in the pulse plasma on-to-off ratio is 2:1 to 1:10.
25 . The method of 1 , 3 , and 15 through exposure in a reaction vessel incorporating convection preheating.
26 . The method of 1 , 3 , and 15 through exposure in a reaction vessel incorporating single and multi zone cooling
27 . The method of 1 , 3 , and 15 through exposure in a reaction vessel incorporating a central anode.
28 . The method of 1 , 3 , and 15 through in a reaction vessel wherein the parts are masked to prevent nitriding in unwanted areas.
29 . The method of 1 , 3 , and 15 through exposure in a reaction vessel incorporating helium as a replacement carrier gas for the hydrogen.
30 . The method of 1 , 3 , and 15 through exposure in a reaction vessel incorporating thermocouple temperature measurement of the parts.
31 . The method of 1 , 3 , and 15 through exposure in a reaction vessel incorporating a sputter step to increase the surface reactivity of the workpiece.
32 . The method of any one of claims 15 to 31 wherein the creation of a substantial nitrogen diffusion layer is avoided.
33 . The method of claim 1 wherein the reaction vessel utilizes a plasma glow discharge as a media for the reaction.
34 . The method of claim 1 wherein the reaction gas is nitrogen.
35 . The method of claim 1 wherein the reaction gases are nitrogen and a carrier gas with optionally argon and optionally a carbon precursor.Join the waitlist — get patent alerts
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