Semiconductor device and method for manufacturing semiconductor device

Abstract

A semiconductor device includes a first semiconductor chip face-down mounted on a substrate, a second semiconductor chip face-up mounted on the first semiconductor chip, and an electromagnetic shielding plate interposed between the first semiconductor chip and the second semiconductor chip.

1 . A semiconductor device, comprising: 
 a first semiconductor chip that is face-down mounted on a substrate;    a second semiconductor chip that is face-up mounted on the first semiconductor chip; and    an electromagnetic shielding plate interposed between the first semiconductor chip and the second semiconductor chip.    
     
     
         2 . A semiconductor device, comprising: 
 a first semiconductor chip that is face-down mounted on a substrate;    a second semiconductor chip that is face-up mounted on the first semiconductor chip; and    a dummy chip that is interposed between the first semiconductor chip and the second semiconductor chip, and having a conductor film formed on an upper or lower surface of the dummy chip.    
     
     
         3 . A semiconductor device, comprising: 
 a first semiconductor chip that is face-down mounted on a substrate;    a second semiconductor chip face-up that is mounted on the first semiconductor chip; and    an electronic component that is arranged below the second semiconductor chip and mounted on the substrate.    
     
     
         4 . A semiconductor device, comprising: 
 a first semiconductor chip face-down that is mounted on a substrate;    a second semiconductor chip face-up that is mounted on the first semiconductor chip;    an electronic component that is arranged below the second semiconductor chip and mounted on the substrate; and    a spacer that is interposed between the first semiconductor chip and the second semiconductor chip, the spacer separating the second semiconductor chip from the electronic component.    
     
     
         5 . The semiconductor device according to  claim 1 , wherein the second semiconductor chip is larger than the first semiconductor chip.  
     
     
         6 . The semiconductor device according to  claim 1 , wherein the first semiconductor chip has an analog IC and the second semiconductor chip has a digital IC.  
     
     
         7 . A method for manufacturing a semiconductor device, comprising: 
 face-down mounting a first semiconductor chip on a substrate;    disposing on the first semiconductor chip a dummy chip having a conductor film formed on an upper or lower surface of the dummy chip; and    face-up mounting a second semiconductor chip on the dummy chip.