Film adhesion device and film adhesion method

Abstract

A film adhesion device includes a table carrying a semiconductor wafer, a pressing member (pressing roller) which presses a film (photoresist film) onto a surface side of the semiconductor wafer placed on the table, a bumper member provided on an outer peripheral side of the table and including a contact surface which is contacted by the pressing member when the pressing member presses the film, and an elevating support mechanism which supports the bumper member elevatably and positions the bumper member at a predetermined height level.

1 . A film adhesion device comprising:
 a table carrying a semiconductor wafer;   a pressing member which presses a film onto a surface side of said semiconductor wafer placed on said table;   a bumper member provided on an outer peripheral side of said table and comprising a contact surface which is contacted by said pressing member when said pressing member presses said film; and   an elevating support mechanism which supports said bumper member elevatably and positions said bumper member at a predetermined height level.   
     
     
         2 . The film adhesion device according to  claim 1 , further comprising a pressing force adjustment mechanism which adjusts a pressing force of said pressing member in accordance with a pressing surface area of said semiconductor wafer. 
     
     
         3 . The film adhesion device according to  claim 2 , wherein said pressing force adjustment mechanism comprises:
 a moving unit which supports said pressing member and is capable of moving along a surface of said semiconductor wafer;   a pressing drive source for displacing said pressing member in a pressing direction; and   a control portion which drive-controls said pressing drive source in accordance with said pressing surface area of said semiconductor wafer.   
     
     
         4 . The film adhesion device according to  claim 1 , wherein said elevating support mechanism comprises:
 a rotary member supported so as to be free to rotate about a vertical axis of said table;   a rotation drive source for rotating said rotary member; and   a power transmission portion provided between said rotary member and said bumper member, which raises and lowers said bumper member using the rotation of said rotary member.   
     
     
         5 . The film adhesion device according to  claim 4 , wherein said power transmission portion comprises:
 a male screw provided on one of said rotary member and said bumper member; and   a female screw provided on the other of said members and screwed to said male screw.   
     
     
         6 . The film adhesion device according to  claim 1 , wherein said film is a photoresist film. 
     
     
         7 . The film adhesion device according to  claim 1 , wherein said pressing member is a pressing roller. 
     
     
         8 . A film adhesion method using the film adhesion device according to  claim 1 , comprising the steps of:
 adjusting said height level of said contact surface of said bumper member by raising or lowering said bumper member using said elevating support mechanism such that said bumper member is positioned at said predetermined height level; and   pressing said film onto said surface side of said semiconductor wafer placed on said table using said pressing member,   wherein, in said pressing step, said pressing member is brought into contact with said contact surface of said height level-adjusted bumper member.   
     
     
         9 . The film adhesion method according to  claim 8 , wherein, in said pressing step, said pressing member is moved along said surface of said semiconductor wafer, and while said pressing member is in motion, said pressing force thereof is adjusted in accordance with said pressing surface area of said semiconductor wafer.