Heat-Resistant Resin

Abstract

The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

1 . A thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.  
     
     
         2 . The thermoplastic resin according to  claim 1 , which has no sea-island structure of 0.1 μm or larger and is transparent, or a precursor resin thereof.  
     
     
         3 . The thermoplastic resin according to  claim 1 , which has a siloxane content of lower than 10% by mass, or a precursor resin thereof.  
     
     
         4 . The thermoplastic resin according to  claim 1 , which is a polyimide resin obtainable by reacting a tetracarboxylic dianhydride with a diamine compound, said diamine compound being a diamine compound which has two ends having an amine structure and has a polyether structure, or a precursor resin thereof.  
     
     
         5 . The thermoplastic resin according to  claim 4 , wherein the diamine compound, which has two ends having an amine structure and has a polyether structure, has a number-average molecular weight of 500 or higher; and wherein the resin contains the polyether structure of the diamine compound in a proportion of 40 to 60% by weight, or a precursor resin thereof.  
     
     
         6 . A photosensitive resin composition comprising the thermoplastic resin according to  claim 1  or a precursor resin thereof; and a photosensitizing agent.  
     
     
         7 . The photosensitive resin composition according to  claim 6 , which comprises: 
 the polyimide resin according to  claim 4  or a precursor resin thereof; and    a 1,4-dihydropyridine compound represented by the formula (I):                          wherein R 1  to R 5  each independently represent a hydrogen atom or an organic group having 1 to 4 carbon atoms.    
     
     
         8 . A resin composition comprising the thermoplastic resin according to  claim 4  or a precursor resin thereof; and a carbon powder.