Integrated inductors and compliant interconnects for semiconductor packaging

Abstract

Some embodiments of the present invention include integrated inductors and compliant interconnects for semiconductor packaging.

1 . An apparatus comprising: 
 an integrated inductor, generally spiral in shape about a substantially straight axis, containing elements that curve in three dimensions on a substrate surface; and    a compliant electrical interconnect on the substrate surface.    
   
   
       2 . The apparatus of  claim 1 , wherein the integrated inductor comprises a magnetic core.  
   
   
       3 . The apparatus of  claim 1 , wherein the integrated inductor comprises a plurality of conductive segments in a row on the substrate, a conductive element connecting an end of a first conductive segment to an opposite end of a second conductive segment, and a magnetic material between the conductive element and the first conductive segment.  
   
   
       4 . The apparatus of  claim 1 , wherein the compliant electrical interconnect comprises a base and an arch extending from the base.  
   
   
       5 . The apparatus of  claim 1 , further comprising: 
 a second substrate connected to the compliant interconnect; and    a peripheral underfill between the substrate and the second substrate.    
   
   
       6 . The apparatus of  claim 1 , wherein the substrate comprises a die having an input/output pad, and wherein the integrated inductor is between the input/output pad and a die edge closest to the input/output pad.  
   
   
       7 . The apparatus of  claim 1 , wherein the substrate comprises a die having an input/output pad and a core pad, and wherein the integrated inductor is between the input/output pad and the core pad.  
   
   
       8 . An apparatus comprising: 
 a circuit at least partially implemented in a substrate, wherein the circuit includes an integrated inductor, generally spiral in shape about a substantially straight axis, containing elements that curve in three dimensions on the substrate.    
   
   
       9 . The apparatus of  claim 8 , wherein the integrated inductor comprises a generally spiral shape and a magnetic core.  
   
   
       10 . The apparatus of  claim 9 , wherein the integrated inductor comprises up to about 15 turns.  
   
   
       11 . The apparatus of  claim 8 , wherein the circuit comprises a frequency filter.  
   
   
       12 . The apparatus of  claim 8 , wherein the circuit comprises an impedance matching circuit.  
   
   
       13 . The apparatus of  claim 8 , wherein the circuit comprises an inductance-capacitance tank including a tuning capacitor.  
   
   
       14 . The apparatus of  claim 13 , wherein the tuning capacitor has a capacitance less than about 1 pF.  
   
   
       15 . The apparatus of  claim 14 , wherein the integrated inductor has an inductance less than about 3 nH.  
   
   
       16 . The apparatus of  claim 15 , wherein the circuit comprises a voltage controlled oscillator capable of operating at 10 GHz or higher.  
   
   
       17 . A system comprising: 
 a microprocessor connected to a substrate by a compliant interconnect;    an integrated inductor, generally spiral in shape about a substantially straight axis, containing elements that curve in three dimensions on the microprocessor; and    a graphics controller.    
   
   
       18 . The system of claim  23 , further comprising: 
 a memory component.