Thermosiphon with thermoelectrically enhanced spreader plate

Abstract

A cooling assembly includes a plate having a center portion for engaging and transferring heat from the electronic device and a peripheral portion surrounding the center portion. A heat sink overlies the plate and receives heat from the plate. A thermoelectric module is disposed between the peripheral portion of the plate and the heat sink for pumping heat laterally from the center portion of the plate to the peripheral portion of the plate and then to the heat sink.

1 . A cooling assembly for cooling an electronic device comprising;
 a plate having a center portion for engaging and transferring heat from the electronic device and a peripheral portion surrounding said center portion,   a heat sink overlying said plate for receiving heat from said plate, and   a thermoelectric module for transferring heat from said plate,   said thermoelectric module being disposed between said peripheral portion of said plate and said heat sink for pumping heat laterally from said center portion of said plate to said peripheral portion of said plate and then to said heat sink.   
   
   
       2 . An assembly as set forth in  claim 1  wherein said thermoelectric module includes a working portion defining a through hole overlying said center portion of said plate, said working portion having a hot side engaging said heat sink and a cold side engaging said peripheral portion of said plate for transferring heat absorbed by said cold side to said hot side. 
   
   
       3 . An assembly as set forth in  claim 2  wherein one of said plate and said heat sink includes an extension extending into said through hole and into engagement with the other of said plate and said heat sink. 
   
   
       4 . An assembly as set forth in  claim 3  wherein said plate defines a cavity disposed in the bottom of said center portion of said plate for receiving the electronic device. 
   
   
       5 . An assembly as set forth in  claim 4  wherein said cavity has a first width and said extension has a second width, said first width being greater than said second width. 
   
   
       6 . An assembly as set forth in  claim 3  wherein said heat sink includes a base and a plurality of heat transfer fins extending upwardly from said base for absorbing heat from said plate. 
   
   
       7 . An assembly as set forth in  claim 6  wherein said heat sink comprises a thermosiphon cooling system having a housing with a lower portion defining said base and an upper portion having a plurality of spaced cooling chambers extending through said housing. 
   
   
       8 . An assembly as set forth in  claim 7  including a refrigerant disposed in said lower portion of said housing for liquid-to-vapor transformation and wherein said heat transfer fins are disposed within said lower portion of said housing for transferring heat from the electronic device to said refrigerant for liquid-to-vapor transformation. 
   
   
       9 . An assembly as set forth in  claim 8  including a plurality of cooling fins disposed within said cooling chambers. 
   
   
       10 . An assembly as set forth in  claim 9  wherein said heat sink is generally rectangular, said plate is generally rectangular, and said thermoelectric module is generally rectangular. 
   
   
       11 . An assembly as set forth in  claim 10  including a first grease layer disposed over the top of said plate for establishing a predetermined thermal interface between said plate and said cold side of said thermoelectric module and said extension. 
   
   
       12 . An assembly as set forth in  claim 11  including a second grease layer disposed over said base of said heat sink for establishing a predetermined thermal interface between said base of said heat sink and said hot side of said thermoelectric module and said extension. 
   
   
       13 . An assembly as set forth in  claim 6  including an air moving device disposed adjacent to said heat sink for moving air over said heat sink. 
   
   
       14 . A cooling assembly for cooling an electronic device comprising;
 a plate having a generally rectangular peripheral portion surrounding a center portion for engaging and transferring heat from the electronic device,   a cavity being generally rectangular and disposed in the bottom of said center portion of said plate for receiving the electronic device,   a first grease layer disposed over the top of said plate,   a heat sink being generally rectangular and including a base overlying said plate for receiving heat from said plate,   a second grease layer disposed over said base of said heat sink,   a plurality of heat transfer fins being generally triangular in cross-section and extending upwardly from said base for absorbing heat from said plate, and   a thermoelectric module having a generally rectangular working portion defining a rectangular through hole for transferring heat from said plate,   said thermoelectric module being disposed between said peripheral portion of said plate and said heat sink for pumping heat laterally from said center portion of said plate to said peripheral portion of said plate and then to said heat sink,   said working portion including a hot side engaging said base of said heat sink and a cold side engaging said peripheral portion of said plate for transferring heat absorbed by said cold side to said hot side,   one of said plate and said heat sink including an extension extending into said through hole and into engagement with the other of said plate and said heat sink,   said cavity having a first width and said extension having a second width and said first width being greater than said second width.   
   
   
       15 . An assembly as set forth in  claim 14  including an air moving device disposed adjacent to said heat sink for moving air over said heat sink. 
   
   
       16 . An assembly as set forth in  claim 14  wherein said heat sink comprises a thermosiphon cooling system having a housing with a lower portion defining said base and an upper portion having a plurality of spaced cooling chambers extending through said housing and including;
 a refrigerant disposed in said lower portion of said housing for liquid-to-vapor transformation,   said heat transfer fins disposed in said lower portion of said housing for transferring heat from the electronic device to said refrigerant for liquid-to-vapor transformation, and   a plurality of cooling fins disposed within said cooling chambers.