Contact load profile modification for a compression socketed cpu

Abstract

A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and wherein a first shim is interposed between the bottom portion and the second clamping hardware.

1 . A integrated circuit housing, comprising: 
 a first clamping hardware; 
 a second clamping hardware operatively connected to the first clamping hardware; and  
   an integrated circuit stack comprising a top portion and a bottom portion;    wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and    wherein a first shim is interposed between the bottom portion and the second clamping hardware.    
   
   
       2 . The integrated circuit housing of  claim 1 , further comprising: 
 An insulator interposed between the first shim and the second clamping hardware.    
   
   
       3 . The integrated circuit housing of  claim 2 , further comprising: 
 A second shim interposed between the insulator and the first shim.    
   
   
       4 . The integrated circuit housing of  claim 2 , wherein the first shim is affixed to the insulator.  
   
   
       5 . The integrated circuit housing of  claim 1 , wherein the first clamping hardware is a heat dissipater.  
   
   
       6 . The integrated circuit housing of  claim 1 , wherein the second clamping hardware is a bolster plate.  
   
   
       7 . The integrated circuit housing of  claim 1 , wherein the integrated circuit stack comprises: 
 a ceramic land grid array package;    an integrated circuit affixed to the ceramic land grid array package; and    a socket configured to house the ceramic land grid array package and the integrated circuit.    
   
   
       8 . The integrated circuit housing of  claim 7 , wherein the integrated circuit stack further comprises: 
 a printed circuit board having a plurality of pads; and    a plurality of contacts arranged to contact the plurality of pads to electrically connect the printed circuit board to the ceramic land grid array package.    
   
   
       9 . The integrated circuit housing of  claim 1 , wherein the first clamping hardware is operatively connected to the second clamping hardware using at least one fastener.  
   
   
       10 . The integrated circuit housing of  claim 1 , wherein the first shim comprises at least one from the group consisting of polyester film, polyamide, and polycarbonate.  
   
   
       11 . The integrated circuit housing of  claim 1 , wherein the second shim comprises at least one from the group consisting of polyester film, polyamide, and polycarbonate.  
   
   
       12 . A method for designing a shim comprising: 
 obtaining a configuration profile of an integrated circuit housing;    analyzing the integrated circuit housing the profile to obtain the configuration of the shim; and    designing the shim using the configuration of the shim.    
   
   
       13 . The method of  claim 12 , wherein analyzing the integrated circuit housing the profile comprises using the profile as input into at least one selected from the group consisting of an analytical model and an empirical model.  
   
   
       14 . The method of  claim 13 , wherein the configuration profile comprises at least one parameter having an effect on load distribution of a contact.  
   
   
       15 . The method of  claim 13 , wherein the configuration profile is stored in a data repository.  
   
   
       16 . A method for designing a shim comprising: 
 obtaining a pressure imprint of load distribution on a contact resulting from applying pressure to the contact;    analyzing the pressure imprint of load distribution on the contact to obtain a configuration of the shim; and    designing the shim using the configuration of the shim.    
   
   
       17 . The method of  claim 16 , further comprising: 
 placing a pressure film between a ceramic land grid array package and the contact; and    applying pressure to the contact.    
   
   
       18 . The method of  claim 16 , further comprising: 
 viewing the pressure imprint.    
   
   
       19 . The method of  claim 16 , wherein analyzing the pressure imprint comprises: 
 digitizing the pressure imprint to produce a digitized image;    analyzing the digitized image to produce a graphic illustration of load distribution using a color intensity scheme;    analyzing the graphic illustration of load distribution to determine a region of low load; and    defining the configuration of the shim using the region of low load.    
   
   
       20 .- 28 . (canceled)