US2007283710A1PendingUtilityA1

Method and system for cooling electronic equipment

Assignee: SUN MICROSYSTEMS INCPriority: Jun 12, 2006Filed: Jun 12, 2006Published: Dec 13, 2007
Est. expiryJun 12, 2026(expired)· nominal 20-yr term from priority
H05K 7/20836H05K 7/20754
43
PatentIndex Score
0
Cited by
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References
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Claims

Abstract

A system includes electronic equipment, a device arranged to cool air using a refrigerant, the device secured to one of a top side and a bottom side of the electronic equipment, and a housing arranged to enclose the electronic equipment and the device, where the cooled air is propagated from one of the top side and the bottom side of the electronic equipment to the other one of the top side and the bottom side of the electronic equipment.

Claims

exact text as granted — not AI-modified
1 . A system, comprising:
 electronic equipment;   a device arranged to cool air using a refrigerant, the device secured to one of a top side and a bottom side of the electronic equipment; and   a housing arranged to enclose the electronic equipment and the device,   wherein the cooled air is propagated from one of the top side and the bottom side of the electronic equipment to the other one of the top side and the bottom side of the electronic equipment.   
   
   
       2 . The system of  claim 1 , the electronic equipment comprising:
 one or more computer systems; and   a chassis arranged to support the one or more computer systems.   
   
   
       3 . The system of  claim 1 , wherein the refrigerant is at least one of water, air, ammonia, and carbon dioxide. 
   
   
       4 . The system of  claim 1 , the housing comprising a first door arranged to allow access to a front side of the electronic equipment, and a second door arranged to allow access to a rear side of the electronic equipment. 
   
   
       5 . The system of  claim 1 , further comprising:
 at least one air flow channel separated from the cooled air by at least one baffle; and   a liquid cooling unit configured to cool a processor in the electronic equipment.   
   
   
       6 . The system of  claim 1 , further comprising:
 at least one blowing device implemented at one of the top side and the bottom side of the electronic equipment.   
   
   
       7 . The system of  claim 1 , the housing comprising:
 an air plenum implemented along one or more of a top side and a bottom side of the housing.   
   
   
       8 . The system of  claim 1 , further comprising:
 a chiller unit operatively connected to the housing, the chiller unit arranged to supply the refrigerant.   
   
   
       9 . A method of cooling electronic equipment, comprising:
 supplying a refrigerant to a device secured to the electronic equipment in a first channel;   generating cold air by using the device to cool air that passes vertically through the device;   directing the cold air into one of a top side and a bottom side of the electronic equipment, wherein the cold air cools the electronic equipment; and   directing air heated by the electronic equipment to the other of the top side and the bottom side of the electronic equipment.   
   
   
       10 . The method of  claim 9 , further comprising:
 supplying refrigerant to a second device secured to the electronic equipment in the first channel; and   generating cold air by using the device to cool the air heated by the electronic equipment that passes vertically through the device.   
   
   
       11 . The method of  claim 9 , further comprising:
 directing one of heated air and cold air through a plenum to a second channel, wherein the air in the second channel moves in a direction opposite that of air in the first channel.   
   
   
       12 . The method of  claim 9 , further comprising:
 propagating air from one of the top side and the bottom side of the electronic equipment to the other of the top side and the bottom side of the electronic equipment.   
   
   
       13 . The method of  claim 9 , wherein the refrigerant is one of water, air, ammonia, and carbon dioxide. 
   
   
       14 . The method of  claim 9 , wherein the electronic equipment is housed in a housing. 
   
   
       15 . An apparatus, comprising:
 electronic equipment in a first channel of a housing; and   a heat exchanger secured to one of a top side and a bottom side of the electronic equipment, the heat exchanger arranged to cool air entering the heat exchanger;   wherein the housing is arranged to house the electronic equipment and the heat exchanger, and   wherein cold air generated by the heat exchanger is arranged to flow within the housing from one of the top side and the bottom side of the electronic equipment to the other one of the top side and the bottom side of the electronic equipment.   
   
   
       16 . The apparatus of  claim 15 , further comprising:
 at least one blowing device implemented at one or more of the top side and the bottom side of the electronic equipment arranged to propagate the air within the housing.   
   
   
       17 . The apparatus of  claim 15 , further comprising:
 a plenum implemented along at least one of a top side and a bottom side of the housing connecting the first channel and a second channel, wherein air in the second channel moves in a direction opposite that of air in the first channel.   
   
   
       18 . The apparatus of  claim 15 , the electronic equipment comprising:
 a plurality of servers; and   a rack arranged to support the plurality of servers.   
   
   
       19 . The apparatus of  claim 15 , wherein the heat exchanger cools air dependent on a refrigerant. 
   
   
       20 . The apparatus of  claim 15 , further comprising a front door of the housing arranged to allow access to a front side of the electronic equipment without affecting air circulation.

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