Two-phase cooling system for cooling power electronic components

Abstract

A two-phase cooling system for cooling power electronic components comprises a condenser section and an evaporator section, each with at least two metal sheets partially bonded together, the at least two metal sheets forming at least one first fluid channel or second fluid channel, respectively being arranged between two bonded areas of the at least two metal sheets. These channels form a continuous, sealed fluid channel, which connects the condenser and evaporator sections. A power electronic element can be arranged on a first main side of the evaporator section within a contact area, and the two-phase cooling system can be pressed against the power electronic component. A support plate is arranged on a second main side of the evaporator section, the second main side being opposite the first main side. The support plate comprises at least one projecting part, which contacts the evaporator section within the at least one bonded area or at least one support element is arranged within the at least one first fluid channel.

1 . Two-phase cooling system for cooling power electronic components,
 the cooling system comprising a condenser section and an evaporator section, the evaporator section comprising at least two metal sheets partially bonded together, the at least two metal sheets forming at least one first fluid channel being arranged between two bonded areas of the at least two metal sheets   and the condenser section comprising at least two metal sheets partially bonded together, the at least two metal sheets forming at least one second fluid channel being arranged between two bonded areas of the at least two metal sheets,   the at least one first and second fluid channel forming at least one continuous, sealed fluid channel, which connects the condenser and evaporator sections, wherein   the evaporator section comprises a first main side with a contact area for contacting a power electronic element, and wherein the two-phase cooling system has at least one of the following features:
 a support plate is arranged on a second main side of the evaporator section, the second main side being opposite the first main side, the support plate comprising at least one projecting part, which contacts the evaporator section within the at least one bonded area or 
 at least one support element is arranged within the at least one first fluid channel. 
   
   
   
       2 . Cooling system according to  claim 1 , wherein
 in case of a support plate being arranged on a second main side of the evaporator section, the at least one projecting part of the support plate is arrangeable outside an area on the second main side, which lies opposite of the contact area.   
   
   
       3 . Cooling system according to  claim 1 , wherein
 the two-phase cooling system comprises at least one spacer as support element.   
   
   
       4 . Power electronic system with a power electronic element and a cooling system according to  claim 1 . 
   
   
       5 . Power electronic system according to  claim 4 , wherein
 a thermal interface material is arranged between the at least one first fluid channel and the power electronic element.   
   
   
       6 . Method for manufacturing a cooling system according to  claim 1 ,
 wherein the at least one first and/or second fluid channel is made by a roll-bonding process.   
   
   
       7 . Power electronic system with a power electronic element and a cooling system according to  claim 3 . 
   
   
       8 . Method for manufacturing a cooling system according to  claim 3 ,
 wherein the at least one first and/or second fluid channel is made by a roll-bonding process.   
   
   
       9 . Two-phase cooling system for cooling power electronic components, the cooling system comprising
 a condenser section, the condenser section comprising at least two first metal sheets partially bonded together, the at least two first metal sheets forming at least one first fluid channel being arranged between two bonded areas of the at least two first metal sheets; and   an evaporator section, the evaporator section comprising at least two second metal sheets partially bonded together, the at least two second metal sheets forming at least one second fluid channel being arranged between two bonded areas of the at least two second metal sheets, wherein   the at least one first and second fluid channels form at least one continuous, sealed fluid channel, which connects the condenser and evaporator sections, wherein   the evaporator section comprises a first main side with a contact area for contacting a power electronic element, and wherein   the two-phase cooling system has at least one of a support plate, or at least one support element associated with the evaporator section.