Packaging structure

Abstract

A packaging structure is provided. The packaging structure is used to package at least two semiconductor elements. The packaging structure includes a flexible film. The flexible film has a contacting surface. The at least two semiconductor elements are placed on the contacting surface. The contacting surface has slight stickiness such that the positions of the at least two semiconductor elements relative to the contacting surface can be held.

1 . A packaging structure for accommodating a plurality of electronic components, comprising:
 a first container; and   a first flexible film, disposed in the first container, having a plurality of first sticky portions for contacting with the electronic components.   
   
   
       2 . The packaging structure according to  claim 1 , further comprising a second flexible film disposed over the first flexible film, wherein the second flexible film has a plurality of second sticky portions for contacting with the electronic components. 
   
   
       3 . The packaging structure according to  claim 2 , further comprising a buffer disposed between the first and the second flexible films. 
   
   
       4 . The packaging structure according to  claim 3 , wherein at least part of one of the first sticky portions and at least part of one of the second sticky portions are overlapped. 
   
   
       5 . The packaging structure according to  claim 3 , wherein the first sticky portions and the second sticky portions are non-overlapped. 
   
   
       6 . The packaging structure according to  claim 3 , further comprising a second container disposed over the first container. 
   
   
       7 . The packaging structure according to  claim 2 , wherein at least part of one of the first sticky portions and at least part of one of the second sticky portions are overlapped. 
   
   
       8 . The packaging structure according to  claim 2 , wherein the first sticky portions and the second sticky portions are non-overlapped. 
   
   
       9 . The packaging structure according to  claim 2 , further comprising a second container disposed over the first container. 
   
   
       10 . The packaging structure according to  claim 9 , further comprising a buffer disposed on the second flexible film. 
   
   
       11 . The packaging structure according to  claim 1 , further comprising a buffer disposed on the first flexible film. 
   
   
       12 . The packaging structure according to  claim 11 , wherein the buffer is comprised of expandable polyethylene (EPE).