Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate

Abstract

Provided are an electroless plating pretreatment liquid used in a copper-clad laminate for a flexible substrate whose initial adhesive force between the substrate material and copper plating layer in an ordinary state as well as the adhesive force in a peel test after aging (in the atmosphere at 150° C. for 168 hours) are at least 0.4 kgf/cm, and a copper-clad laminate for a flexible substrate produced using same. The electroless plating pretreatment agent used in a substrate material of a copper-clad laminate for a flexible substrate comprising a thermoset resin and a silane coupling agent having a metal capturing capability. The copper-clad laminate for a flexible substrate wherein a substrate material is treated with the electroless plating pretreatment agent, a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.

1 . An electroless plating pretreatment agent applied to a substrate material of a copper-clad laminate for a flexible substrate, comprising a thermoset resin and a silane coupling agent having a metal capturing capability.  
     
     
         2 . An electroless plating pretreatment agent according to  claim 1 , wherein said thermoset resin is an epoxy resin.  
     
     
         3 . A copper-clad laminate for a flexible substrate, wherein a substrate material is treated with the electroless plating pretreatment agent according to  claim 1 , a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.