Method and apparatus for manufacture and inspection of semiconductor device

Abstract

A semiconductor device is manufactured in such a way that a semiconductor chip connected with leads whose internal ends are interconnected with bonding wires are completely sealed and enclosed in a resin corresponding to a package while external ends of leads are exposed from the surface of the package. In manufacture, a chip fixing member is used to fix the semiconductor chip in a prescribed position, while wire fixing members are used to fix the bonding wires in prescribed positions. Both the fixing members are retracted into the split mold so as to avoid formation of unfilled portions or voids in the resin in the cavity. In inspection, an electrical conduction is detected between the bonding wire(s) and an electrode layer formed inside of the cavity, so that a semiconductor device produced in the cavity is automatically removed from the manufacturing line.

1 . A manufacturing method of a semiconductor device in which a semiconductor chip connected with leads whose internal ends are interconnected with bonding wires is sealed in a resin while external ends of the leads are exposed outside of the resin, the method comprising: 
 performing a mold setup process in which a frame assembly comprising the semiconductor chip, which is mounted on a stage of a frame having lead stays supporting the leads in such a way that the internal ends of the leads are respectively interconnected with the bonding wires, is set into a mold unit comprising a pair of split molds in such a way that the external ends of the leads are supported on split surfaces of the split molds, wherein the frame assembly is bridged across a cavity of the mold unit in such a way that the semiconductor chip connected with the leads whose internal ends are interconnected with the bonding wires is completely contained in the cavity;    performing a wire fixation process in which at least one wire fixing member, which is freely inserted into and extracted from the cavity of the mold unit, is projected inside of the cavity and presses the bonding wires to be temporarily fixed in position;    performing a resin filling process in which a resin for use in formation of a package is injected into the cavity, in which the bond wires are temporarily fixed in position by the wire fixing member, then, the wire fixing member is retracted from the split mold before the cavity is completely filled with the resin; and    performing a resin fixation process in which the resin completely filling the cavity is subjected to solidification.    
     
     
         2 . The manufacturing method of a semiconductor device according to  claim 1 , further comprising performing a frame assembly process in which the semiconductor chip is mounted on the stage of the frame having the lead stays supporting the leads in such a way that the internal ends of the leads are respectively interconnected with the bonding wires, thus forming the frame assembly.  
     
     
         3 . The manufacturing method of a semiconductor device according to  claim 1 , wherein before the wire fixation process, a protective film is formed on a surface of the semiconductor device.  
     
     
         4 . The manufacturing method of a semiconductor device according to  claim 1 , wherein before the resin filling process, at least one chip fixing member, which is freely inserted into and extracted from the cavity, is projected into the cavity and presses the semiconductor chip to be temporarily fixed in position, then, before the cavity is completely filled with the resin, the chip fixing member is retracted from the split mold.  
     
     
         5 . The manufacturing method of a semiconductor device according to  claim 3 , wherein before the resin filling process, at least one chip fixing member, which is freely inserted into and extracted from the cavity, is projected into the cavity and presses the semiconductor chip to be temporarily fixed in position, then, before the cavity is completely filled with the resin, the chip fixing member is retracted into the split mold.  
     
     
         6 . A semiconductor device that is manufactured in accordance with the manufacturing method as defined in  claim 5 .  
     
     
         7 . A manufacturing method of a semiconductor device in which a semiconductor chip connected with leads whose internal ends are interconnected with bonding wires is sealed in a resin while external ends of the leads are exposed outside of the resin, the method comprising: 
 performing a mold setup process in which a frame assembly comprising the semiconductor chip, which is mounted on a stage of a frame having lead stays supporting the leads in such a way that the internal ends of the leads are respectively interconnected with the bonding wires, is set into a mold unit comprising a pair of split molds in such a way that the external ends of the leads are supported on split surfaces of the split molds, wherein the frame assembly is bridged across a cavity of the mold unit in such a way that the semiconductor chip connected with the leads whose internal ends are interconnected with the bonding wires is completely contained in the cavity;    performing a chip fixation process in which at least one chip fixing member, which is freely inserted into and extracted from the cavity of the mold unit, is projected inside of the cavity and comes into contact with a stage bar so as to cause the semiconductor chip to be temporarily fixed in position;    performing a resin filling process in which a resin for use in formation of a package is injected into the cavity, in which the semiconductor chip is temporarily fixed in position by the chip fixing member, then, the chip fixing member is retracted into the split mold before the cavity is completely filled with the resin; and    performing a resin fixation process in which the resin completely filling the cavity is subjected to solidification.    
     
     
         8 . A manufacturing method of a semiconductor device in which a semiconductor chip connected with leads whose internal ends are interconnected with bonding wires is sealed in a resin while external ends of the leads are exposed outside of the resin, the method comprising: 
 performing a mold setup process in which a frame assembly comprising the semiconductor chip, which is mounted on a stage of a frame having lead stays supporting the leads in such a way that the internal ends of the leads are respectively interconnected with the bonding wires, is set into a mold unit comprising a pair of split molds in such a way that the external ends of the leads are supported on split surfaces of the split molds, wherein the frame assembly is bridged across a cavity of the mold unit in such a way that the semiconductor chip connected with the leads whose internal ends are interconnected with the bonding wires is completely contained in the cavity;    performing a chip fixation process in which at least one chip fixing member, which is introduced into the inside of the mold from an upper surface side of the chip, is projected inside of the cavity and comes into contact with the stage so as to cause the semiconductor chip to be temporarily fixed in position;    performing a resin filling process in which a resin for use in formation of a package is injected into the cavity, in which the semiconductor chip is temporarily fixed in position by the chip fixing member, then, the chip fixing member is retracted into the split mold before the cavity is completely filled with the resin; and    performing a resin fixation process in which the resin completely filling the cavity is subjected to solidification.