Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatus

Abstract

A plurality of unit areas (bit) B are set on a base board. A liquid drop made of a liquid member is ejected to the unit area B from a liquid drop ejecting head so as to form a layer on the base board. A first pattern is formed by a first nozzle group Na in nozzles N which are formed in the liquid drop ejecting head. A second pattern is formed by a second nozzle group Nb which is different from the first nozzle group Na. By doing this, it is possible to maintain a stable ejection operation so as to form a pattern in preferable accuracy when patterns having different features are formed on the base board by using the liquid drop ejecting apparatus.

1 . An apparatus for forming a predetermined wiring pattern on a base board by ejecting a liquid drop from a liquid drop ejecting head onto a plurality of unit areas formed on the base board, the liquid drop being made from conductive particles dispersed in a dispersion medium, the apparatus comprising: 
 a liquid drop ejecting head including a first nozzle group and a second nozzle group which is different from the first nozzle group; and    a controlling section to control an ejection operation of the liquid drop ejection head which substantially forms a first pattern by the first nozzle group and forms a second pattern by the second nozzle group,    wherein the liquid drop is ejected to a unit area by the first nozzle group, and the liquid drop is ejected to a border section between unit areas by the second nozzle group, and    wherein the first pattern corresponds to a linear line pattern expanding in an X-axis direction and corresponds to unit areas of an inclining line pattern connected to the linear line pattern and expanding in an inclining direction to the expanding direction of the linear line pattern, the second pattern corresponding to the border section between the unit areas of the inclining line pattern, so that the first and second pattern are formed on the base board.    
   
   
       2 . The apparatus according to  claim 1 , further comprising an inclination controlling device for controlling an inclination angle of the liquid drop ejection head.  
   
   
       3 . The apparatus according to  claim 1 , further comprising an ejection quantity adjusting section for adjusting the liquid drop ejection quantity from nozzles in the liquid drop ejecting head.  
   
   
       4 . The apparatus according to  claim 1 , wherein the first nozzle group and the second nozzle group are disposed in an equal interval vertically in the liquid drop ejecting head in a nozzle array, and the second nozzle group is disposed to have a main nozzle therebetween in the nozzle array.  
   
   
       5 . The apparatus according to  claim 1 , wherein an interval between the first nozzle group and the second nozzle group is determined according to an interval between the unit areas in the liquid drop ejecting head.  
   
   
       6 . The apparatus according to  claim 1 , wherein surface tension of a dispersion medium in which a conductive particle is dispersed is in a range of 0.02 N/m to 0.07 N/m.  
   
   
       7 . The apparatus according to  claim 1 , wherein a viscosity of a dispersion medium is in a range of 1 mPa·s to 50 mPa·s.  
   
   
       8 . The apparatus according to  claim 1 , wherein the conductive particles are dispersed in the dispersion medium with a dispersion density in a range of 1 weight % to 80 weight %.  
   
   
       9 . A device having a predetermined wiring pattern formed by the apparatus according to  claim 1 .  
   
   
       10 . An electronic apparatus provided with a device according to  claim 9.