Semiconductor Device

Abstract

A semiconductor device including a multiplicity of large current power elements with each power element divided into a multiplicity of divisional elements and arranged such that the power elements belonging to different power elements are arranged in a repetitive sequential order. The IC chip of the semiconductor device is formed to have output wires extending from the respective divisional elements connected to corresponding output pads without crossing other output wires. Arranged on the IC chip are output bumps in association with the respective output pads. A rewiring layer is provided having output coupling wires for connecting together the bumps that belong to the same power element and connecting them further to an external output electrode.

1 - 16 . (canceled)  
   
   
       17 . A semiconductor device, comprising: 
 multiplicity N (N≧2) of semiconductor power elements each divided into M (M≧2) divisional elements with N×M divisional elements arranged such that divisional elements belonging to different power elements are arranged in juxtaposition and in repetitive sequential order;    a multiplicity N×M output pads associated with said N×M divisional elements;    output wires for connecting each of said N×M divisional elements to associated one of said N×M output pads without crossing one another; and    signal wires for connecting said multiplicity M divisional elements that belong to a respective semiconductor power elements to each other.    
   
   
       18 . The semiconductor device according to  claim 17 , further comprising power supply wires or grounding wires for connecting said N×M divisional elements to at least one power supply pad or one grounding pad, respectively, wherein said power supply wires and grounding wires are formed using a wiring layer different from the wiring layer for said output wires.