Cmos image sensor and method of manufacturing same
Abstract
Disclosed are a complementary metal oxide semiconductor (CMOS) image sensor and a method of forming the same. The CMOS image sensor comprises a semiconductor substrate having a photodiode region and a transistor region. An optical path is formed between a micro lens on the photodiode region and a photodiode formed on the semiconductor substrate. The optical path comprises an inner lens formed between an intermetal insulation layer on the photodiode region and a transparent optical region formed on the inner lens. The transparent optical region generally has a different refractive index from the inner lens.
Claims
exact text as granted — not AI-modified1 . A complementary metal oxide semiconductor (CMOS) image sensor, comprising:
a substrate having a photodiode region and a transistor region; a photodiode formed in the photodiode region; a transistor formed in the transistor region; a planarized insulation layer covering the photodiode and the plurality of transistors; an intermetal insulation layer formed from a first material on the planarized insulation layer; a metal wire layer formed on the transistor region at least partially within the intermetal insulation layer; an inner lens formed on the planarized insulation layer over the photodiode as part of the intermetal insulation layer; and, a transparent optical region formed from a second material different from the first material and formed at least partially within the intermetal insulation layer over the inner lens.
2 . The CMOS image sensor of claim 1 , wherein the inner lens is a convex lens.
3 . The CMOS image sensor of claim 1 , wherein the inner lens is a concave lens.
4 . The CMOS image sensor of claim 1 , wherein the intermetal insulation layer comprises a film formed from at least one material selected from a group consisting of an oxide and a nitride.
5 . The CMOS image sensor of claim 4 , wherein the inner lens is formed from an oxide film.
6 . The CMOS image sensor of claim 1 , wherein the transparent optical region is formed from a material having a different refractive index from that of the inner lens.
7 . The CMOS image sensor of claim 6 , wherein the inner lens is a convex lens and the transparent optical region is formed of a material having a lower refractive index than the inner lens.
8 . The CMOS image sensor of claim 6 , wherein the inner lens is a concave lens and the transparent optical region is formed of a material having a higher refractive index than the inner lens.
9 . The CMOS image sensor of claim 6 , wherein the inner lens is formed of an oxide film and the transparent optical region is formed of an organic polymer compound.
10 . The CMOS image sensor of claim 1 , further comprising:
a transparent optical liner formed between the inner lens and the transparent optical region.
11 . The CMOS image sensor of claim 10 , where in the transparent optical liner is formed of a material having a different refractive index from the inner lens and the transparent optical region.
12 . The CMOS image sensor of claim 11 , wherein the transparent optical liner is formed of a silicon nitride, a silicon oxide-nitride, or an organic polymer compound.
13 . The CMOS image sensor of claim 10 , wherein the inner lens is formed of an oxide film, the transparent optical liner is formed of a silicon nitride, a silicon oxide-nitride, or an organic polymer compound, and the transparent optical region is formed of an organic polymer compound.
14 . The CMOS image sensor of claim 10 , wherein the inner lens is a convex lens and the transparent optical liner is formed with a convex shape on an upper surface of the inner lens.
15 . The CMOS image sensor of claim 14 , wherein the transparent optical liner has lower refractive index than the inner lens and the transparent optical region has a lower refractive index than the transparent optical liner.
16 . The CMOS image sensor of claim 10 , wherein the inner lens is a concave lens and the transparent optical liner is formed with a concave shape on an upper surface of the inner lens.
17 . The CMOS image sensor of claim 16 , wherein the transparent optical liner has a higher refractive index than the inner lens and the transparent optical region has a higher refractive index than the transparent optical liner.
18 . The CMOS image sensor of claim 18 , wherein the inner lens is formed on a common plane with the metal wire layer.
19 . The CMOS image sensor of claim 1 , further comprising:
a color filter formed on the transparent optical region; and, a micro lens formed on the color filter and opposite the photodiode.
20 . The CMOS image sensor of claim 19 , further comprising a planarized layer covering the metal wire layer and the transparent optical region;
wherein the color filter is formed on the planarized layer.
21 . The CMOS image sensor of claim 20 , wherein the planarized layer is formed of the same material as the transparent optical region.Join the waitlist — get patent alerts
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