Sawing Apparatus and a Control Method for Manufacturing Processes of Semiconductor Package

Abstract

Disclosed is a sawing apparatus for manufacturing a semiconductor package, capable of simultaneously performing strip loading work and package unloading work during the sawing process to improve productivity of the semiconductor packages. The sawing apparatus includes a chuck table base 200; a chuck table 23 installed on the chuck table base 200 such that the chuck table 23 horizontally moves on the chuck table base 200; two chuck plates 233 a and 233 b rotatably installed on the chuck table 23 such that a strip S is loaded on upper surfaces of the chuck plates 233 a and 233 b by turns; a sawing machine 30 for dividing the strip S loaded on the chuck plate into individual packages P by performing a relative movement with respect to the chuck table 23; and a strip/package picker 22 for loading the strip S onto the chuck plates and unloading the packages P from the chuck plates,

1 . A sawing apparatus for manufacturing a semiconductor package, the sawing apparatus comprising: 
 a chuck table base;    a chuck table installed on the chuck table base such that the chuck table horizontally moves on the chuck table base;    two chuck plates rotatably installed on the chuck table such that a strip is loaded on upper surfaces of the chuck plates by turns;    a sawing machine for dividing the strip loaded on the chuck plate into individual packages by performing a relative movement with respect to the chuck table; and    a strip/package picker for loading the strip onto the chuck plates and unloading the packages from the chuck plates, simultaneously.    
   
   
       2 . The sawing apparatus as claimed in  claim 1 , wherein the chuck table is rotated from an initial position thereof by an angle of 180° when a sawing process has been finished in such a manner that a new strip is loaded onto the chuck plates of the chuck table and the packages are unloaded from the chuck table by means of the strip/package picker, simultaneously.  
   
   
       3 . The sawing apparatus as claimed in  claim 2 , wherein the chuck table is alternately rotated in forward and reverse directions by an angle of 180° so as to prevent cables from being entangled.  
   
   
       4 . The sawing apparatus as claimed in  claim 2 , wherein a rotational direction and a rotating angle of the chuck table is controlled such that the chuck table is positioned within an angle of 180° from the initial position thereof when the strip is aligned.  
   
   
       5 . The sawing apparatus as claimed in  claim 1 , wherein the sawing machine includes a spindle which is rotated as a predetermined power is applied thereto and a sawing blade installed at one end of the spindle so as to divide the strip into individual packages, a rotational direction of the spindle being controlled such that chips generated during a sawing process for the strip are not directed toward the chuck plate having no strip loaded thereon.  
   
   
       6 . A method of controlling a sawing apparatus for manufacturing a semiconductor package and including two chuck plates, the method comprising the steps of: 
 i) loading a strip on a first chuck plate of two chuck plates;    ii) aligning the strip loaded on the first chuck plate;    iii) sawing the strip loaded on the first chuck plate into individual packages; and    iv) unloading the packages by rotating the first chuck plate from an initial position thereof by an angle of 180° and loading a new strip onto a second chuck plate of two chuck plates, simultaneously.    
   
   
       7 . The method as claimed in  claim 6 , wherein, in step ii), a rotational direction and a rotating angle of a chuck table is controlled such that the chuck table is positioned within an angle of 180° from an initial position thereof.  
   
   
       8 . The method as claimed in  claim 7 , wherein chips generated during a sawing process for the strip are directed in a predetermined direction without being directed toward the second chuck plate having no strip loaded thereon.  
   
   
       9 . The method as claimed in  claim 7 , wherein, after step iii), the packages aligned in a position rotated from the initial position of the chuck table by an angle of 180° are horizontally transferred to a package unloading position.  
   
   
       10 . The method as claimed in any one of  claims 6  to  9 , wherein steps ii) to iv) are repeated after step iv) has been finished, in which a rotational direction of the strip is reversed in each step.  
   
   
       11 . A sawing apparatus for manufacturing a semiconductor package, the sawing apparatus comprising: 
 a chuck table base;    a chuck table installed on the chuck table base such that the chuck table horizontally moves in a Y-axis direction on the chuck table base;    two chuck plates rotatably installed on the chuck table such that a strip is loaded on upper surfaces of the chuck plates by turns;    a sawing machine for dividing the strip loaded on the chuck plate into individual packages by performing a relative movement with respect to the chuck table;    a strip picker for loading the strip onto the chuck plate while moving in an X-axis direction; and    a package picker for unloading the packages from the chuck plate while moving in the X-axis direction in parallel to the strip picker when the strip picker loads the strip onto the chuck plate.