US2007259132A1PendingUtilityA1

Composite material

47
Individually held — no corporate assignee on recordPriority: Sep 30, 2002Filed: May 21, 2007Published: Nov 8, 2007
Est. expirySep 30, 2022(expired)· nominal 20-yr term from priority
Inventors:Eva Moser
C23C 14/5853Y10T442/2631C23C 30/00C23C 14/083Y10T442/3984
47
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Claims

Abstract

Composite material ( 10 ) comprises a substrate ( 1 ) and a chemically, mechanically, physically, catalytically and/or optically functional titanium oxide layer ( 2 ), applied on at least one side thereof. A titanium oxide layer ( 2 ) is deposited on the substrate ( 1 ) as a base layer ( 3 ), made from TiO x with an oxygen content of 0.7≦x<2, or made from TiO x (OH) y with an oxygen content of 0.5≦x<2 and a hydroxide content of 0≦y<0.7 and an upper layer ( 4 ) of amorphous and/or crystalline TiO 2 applied to said base layer ( 3 ). In a first method variation, firstly a base layer ( 3 ) of TiO x with an oxygen content of 0.7≦x<2 is reactively or non-reactively deposited, then, through an increase in the oxygen content, the process pressure, the capacity and/or the substrate temperature, an upper layer ( 4 ) of amorphous and/or crystalline TiO 2 is deposited. In a second method variation, firstly a base layer ( 3 ) of TiO x with an oxygen content of 0.7≦x≦2 is reactively or non-reactively deposited and then post-oxidized on the surface by means of an electrochemical, thermal and/or plasma process, until the base layer ( 3 ) is converted into amorphous or crystalline TiO 2 at least partly in an upper layer ( 4 ).

Claims

exact text as granted — not AI-modified
1 . Process for deposition on a substrate ( 1 ) of a titanium oxide layer ( 2 ), with a chemical, physical, mechanical, catalytic, and/or optical function characterized in that 
 first reactively or non-reactively a base layer ( 3 ) is deposited of TiO x  with an oxygen content of 0.7≦x<2, then by increasing the oxygen content, process pressure, power and/or substrate temperature a top layer ( 4 ) is deposited of an amorphous or crystalline TiO 2 .    
   
   
       2 . Process for deposition on a substrate ( 1 ) of a titanium oxide layer ( 2 ), with a chemical, physical, mechanical, catalytic, and/or optical function characterized in that 
 first reactively or non-reactively a base layer ( 3 ) is deposited of TiO x (OH) y  with an oxygen content of 1.5≦x<1.9 and a hydroxide content of 0.2≦y<1.7, then by increasing the oxygen content, process pressure, power and/or substrate temperature a top layer ( 4 ) is deposited of an amorphous or crystalline TiO 2 .    
   
   
       3 . Process according to  claim 1 , characterized in that the substrate ( 1 ) comprises highly flammable and/or heat sensitive materials of polymers, polymer-like or natural materials.  
   
   
       4 . Process according to  claim 1 , characterized in that a plasma enhanced deposition processes such as magnetron sputtering, spark discharge, and plasma MOCVD are used to deposit the base layer ( 3 ) and/or the top layer ( 4 ) on a not heated substrate.  
   
   
       5 . Process according to  claim 1 , characterized in that the base layer ( 3 ) is applied after a plasma activation of the substrate ( 1 ).  
   
   
       6 . Process according to  claim 1 , characterized in that the base layer ( 3 ) is applied after the deposition of a protective layer of at least one metal oxide of the group which preferably comprises MgO, ZnO, ZrO 2 , In 2 O 3 , Sb 2 O 3 , Al 2 O 3 , and SiO 2 , and/or a polar adhesion layer and an adhesion-promotion layer.  
   
   
       7 . Process according to  claim 1 , characterized in that between the base layer ( 3 ) and the top layer ( 4 ) of the titanium oxide layer ( 2 ) is deposited an electrically conductive intermediate layer which preferably comprises TiO x  with an oxygen content of 0.5≦x≦1.5.  
   
   
       8 . Process according to  claim 1 , characterized in that the process is performed at a substrate temperature ≦200° C. or on not-heated substrates.  
   
   
       9 . Process according to  claim 1 , characterized in that the base layer ( 3 ) has a total layer thickness of 3 to 1000 nm where the top layer ( 4 ) has a thickness in the range 10 to 50% of the total layer thickness ( 2 ) and that at least the nine top atomic layer ( 4 ) mainly comprise the TiO 2  modification anatase.  
   
   
       10 . Method of using a substrate ( 1 ) treated using the process according to  claim 1 , comprising utilizing the substrate as active hygiene protection for the preparation of drinking water, watery solutions and air, for textiles, curtains, carpets, films, membranes, cables, packaging, glassware, windows, composite materials, elements in medical technology, photovoltaic's, and optical systems, gas sensors and electronic circuits.  
   
   
       11 . Method of using a substrate ( 1 ) treated using the process according to  claim 1 , comprising utilizing the substrate as active hygiene protection for highly flammable and/or heat-sensitive materials such as polymers, low melting metals, composites, and natural substances in the form of rigid to flexible films, fabrics, membranes, fibres, tubes, containers, and powders.  
   
   
       12 . Method of using a plastic substrate ( 1 ) treated using the process according to  claim 1 , comprising utilizing the substrate to increase the thermal stability and flame inhibition of polymer materials in the form of films, membranes, fibres, powders, textiles, fabrics, tubes, and containers.  
   
   
       13 . Method of using a substrate ( 1 ) treated using the process according to  claim 1 , comprising utilizing the substrate to increase the thermal stability and flame inhibition of polymers, low melting metals, composites, and natural substances in the form of rigid to flexible films, fabrics, membranes, fibres, tubes, containers, and powders.  
   
   
       14 . Process according to  claim 2 , characterized in that the substrate ( 1 ) comprises highly flammable and/or heat sensitive materials of polymers, polymer-like or natural materials.  
   
   
       15 . Process according to  claim 2 , characterized in that a plasma enhanced deposition processes such as magnetron sputtering, spark discharge, and plasma MOCVD are used to deposit the base layer ( 3 ) and/or the top layer ( 4 ) on a not heated substrate.  
   
   
       16 . Process according to  claim 2 , characterized in that the base layer ( 3 ) is applied after a plasma activation of the substrate ( 1 ).  
   
   
       17 . Process according to  claim 2 , characterized in that the base layer ( 3 ) is applied after the deposition of a protective layer of at least one metal oxide of the group which preferably comprises MgO, ZnO, ZrO 2 , In 2 O 3 , Sb 2 O 3 , Al 2 O 3 , and SiO 2 , and/or a polar adhesion layer and an adhesion-promotion layer.  
   
   
       18 . Process according to  claim 2 , characterized in that between the base layer ( 3 ) and the top layer ( 4 ) of the titanium oxide layer ( 2 ) is deposited an electrically conductive intermediate layer which preferably comprises TiO x  with an oxygen content of 0.5≦x≦1.5.  
   
   
       19 . Process according to  claim 2 , characterized in that the process is performed at a substrate temperature ≦200° C or on not-heated substrates.  
   
   
       20 . Process according to  claim 2 , characterized in that the base layer ( 3 ) has a total layer thickness of 3 to 1000 nm, preferably 10 to 200 nm, where the top layer ( 4 ) has a thickness in the range 10 to 50% of the total layer thickness ( 2 ) and that at least the nine top atomic layer ( 4 ) mainly comprise the TiO 2  modification anatase.  
   
   
       21 . Method of using a substrate ( 1 ) treated using the process according to  claim 2 , comprising utilizing the substrate as active hygiene protection for the preparation of drinking water, watery solutions and air, for textiles, curtains, carpets, films, membranes, cables, packaging, glassware, windows, composite materials, elements in medical technology, photovoltaic's, and optical systems, gas sensors and electronic circuits.  
   
   
       22 . Method of using a substrate ( 1 ) treated using the process according to  claim 2 , comprising utilizing the substrate as active hygiene protection for in particular highly flammable and/or heat-sensitive materials such as polymers, low melting metals, composites, and natural substances in the form of rigid to flexible films, fabrics, membranes, fibres, tubes, containers, and powders.  
   
   
       23 . Method of using a plastic substrate ( 1 ) treated using the process according to  claim 2 , comprising utilizing the substrate to increase the thermal stability and flame inhibition of polymer materials in the form of films, membranes, fibres, powders, textiles, fabrics, tubes, and containers.  
   
   
       24 . Method of using a substrate ( 1 ) treated using the process according to  claim 2 , comprising utilizing the substrate to increase the thermal stability and flame inhibition of polymers, low melting metals, composites, and natural substances in the form of rigid to flexible films, fabrics, membranes, fibres, tubes, containers, and powders.  
   
   
       25 . Method of using a substrate ( 1 ) treated using the process according to  claim 9 , comprising utilizing the substrate as active hygiene protection for the preparation of drinking water, watery solutions and air, for textiles, curtains, carpets, films, membranes, cables, packaging, glassware, windows, composite materials, elements in medical technology, photovoltaic's, and optical systems, gas sensors and electronic circuits.  
   
   
       26 . Method of using a substrate ( 1 ) treated using the process according to  claim 9 , comprising utilizing the substrate as active hygiene protection for in particular highly flammable and/or heat-sensitive materials such as polymers, low melting metals, composites, and natural substances in the form of rigid to flexible films, fabrics, membranes, fibres, tubes, containers, and powders.  
   
   
       27 . Process according to  claim 1 , characterized in that the base layer ( 3 ) has a total layer thickness of 10 to 200 nm, where the top layer ( 4 ) has a thickness in the range 10 to 50% of the total layer thickness ( 2 ) and that at least the nine top atomic layer ( 4 ) mainly comprise the TiO 2  modification anatase.  
   
   
       28 . Process according to  claim 2 , characterized in that the base layer ( 3 ) has a total layer thickness of 10 to 200 nm, where the top layer ( 4 ) has a thickness in the range 10 to 50% of the total layer thickness ( 2 ) and that at least the nine top atomic layer ( 4 ) mainly comprise the TiO 2  modification anatase.

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