Leaded Package Integrated Circuit Stacking

Abstract

There is provided a stacked IC module including first and second leaded packages in stacked disposition, each of the first and second leaded packages having plural leads emergent along at least one side of each of the respective leaded packages, and a flexible circuit disposed in part between the first and second leaded packages, wherein the flexible is folded back on itself to create an arcuate connective field that is compressed to have conformity with the plural leads of the first and second leaded packages.

1 . A stacked IC module comprising: 
 first and second leaded packages in stacked disposition, each of the first and second leaded packages having plural leads emergent along at least one side of each of the respective leaded packages; and    a flexible circuit disposed in part between the first and second leaded packages, wherein the flexible is folded back on itself to create an arcuate connective field that is compressed to have conformity with the plural leads of the first and second leaded packages.    
   
   
       2 . The stacked IC module of  claim 1 , wherein the arcuate connective field is compressed to form a planar contact with the plural leads of both the first and second leaded packages.  
   
   
       3 . The stacked IC module of  claim 1 , wherein the flexible circuit is bonded to itself in the portion of the flexible circuit that is folded back.  
   
   
       4 . The attached IC module of  claim 3 , wherein the flexible circuit is bonded to itself with a non-conductive adhesive.  
   
   
       5 . The stacked IC module of  claim 1 , in which the first and second leaded packages include flash memory circuitry.  
   
   
       6 . The stacked IC module of  claim 1 , in which the connective field is disposed about a form.  
   
   
       7 . The stacked IC module of  claim 6 , in which the form is comprised of elastomer.  
   
   
       8 . A leaded package interconnection system comprising: 
 a flexible circuit folded back upon itself to form an arcuate connection field, wherein the arcuate connective field, wherein the arcuate connection field is configured to deform in shape when the flexible circuit is disposed between two leaded packages.    
   
   
       9 . The leaded package interconnection system of  claim 8 , wherein the flexible circuit is bonded to itself to form the arcuate connection field.  
   
   
       10 . The leaded package interconnection system of  claim 8 , comprising an elastomer form disposed within the arcuate connection field.  
   
   
       11 . The leaded package interconnection system of  claim 8 , wherein the arcuate connection field is configured to form a planar connection with leads emergent from the two leaded packages.  
   
   
       12 . The leaded package interconnection system of  claim 8 , comprising the two leaded packages.  
   
   
       13 . The leaded package interconnection system of  claim 8 , wherein the flexible circuit is folded back on itself on both ends of the flexible circuit.  
   
   
       14 . A stacked IC module construction method comprising: 
 providing a flex circuit that exhibits at least one connective field configured in an arcuate shape;    providing first and second leaded ICs, the first and second leaded ICs each having leads emergent from at least one side; and    disposing together, the first and second ICs with the flex circuit between to deform the connective field to be conformal with the leads of the first and second leaded ICs to realize contact between selected contact areas of the at least one connective field and selected ones of the leads of the first and second ICs.    
   
   
       15 . The method of  claim 14 , comprising disposing an adhesive between at least one of the first and second ICs and the flex circuit.  
   
   
       16 . The method of  claim 14 , in which the first and second ICs are each memory circuits in leaded packages.  
   
   
       17 . The method of  claim 14 , in which the flex circuit exhibits two connective fields each of which includes plural contact areas and the flex circuit is comprised of at least two layers with a first of the two layers being comprised of copper and the second of the two layers being comprised of a dielectric.  
   
   
       18 . The method of  claim 17 , in which the layer comprised of copper is deposited on the layer comprised of the dielectric.