US2007255516A1PendingUtilityA1

Operating voltage determination for and integrated circuit

Assignee: ADVANCED RISC MACH LTDPriority: Nov 14, 2003Filed: Jul 2, 2007Published: Nov 1, 2007
Est. expiryNov 14, 2023(expired)· nominal 20-yr term from priority
G06F 1/32G06F 1/26G01R 31/3004G06F 1/324G01R 31/31718G06F 1/3296Y02D10/00G06F 1/3203
52
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Claims

Abstract

Voltage-binning of individual integrated circuits is achieved by operating those integrated circuits at a plurality of required clock frequencies and for each of those frequencies determining the minimum supply voltage level which produces a pass result for a series of applied test vectors.

Claims

exact text as granted — not AI-modified
1 . A method of sorting integrated circuits, said method comprising the steps of: 
 providing a plurality of integrated circuits, each circuit having a lowest operating voltage capable of sustaining a required frequency; and    operating voltage binning of said integrated circuits in accordance with their respective lowest operating voltage.    
   
   
       2 . A method as claimed in  claim 1 , wherein an operating voltage is determined for each of a plurality of required operating frequencies.  
   
   
       3 . A method as claimed in  claim 1 , wherein said operating voltage includes a supply level voltage.  
   
   
       4 . A method as claimed in  claim 1 , wherein said operating voltage includes a body bias voltage.  
   
   
       5 . A method as claimed in  claim 1 , wherein said operating voltage is determined such that it is higher than said lowest operating voltage by at least a predetermined margin.  
   
   
       6 . A method as claimed in  claim 1 , wherein said operating voltage and said required operating frequency are stored in a storage module associated with said integrated circuit.  
   
   
       7 . A method as claimed in  claim 6 , wherein said storage module is a programmable read only memory.  
   
   
       8 . A method as claimed in  claim 6 , wherein said storage module is a bar code applied to packaging of said individual integrated circuit.  
   
   
       9 . A method as claimed in  claim 1 , wherein said method is performed upon fabrication of said integrated circuit prior to incorporating said integrated circuit within a larger circuit.  
   
   
       10 . A method as claimed in  claim 1 , wherein said method is performed upon coupling said integrated circuit to further circuit elements within a larger circuit.

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