US2007253858A1PendingUtilityA1
Copper multicomponent alloy and its use
Est. expiryApr 28, 2026(expired)· nominal 20-yr term from priority
C22C 9/02C22C 9/06F16C 2204/10F16C 33/121C22C 1/06
50
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
The invention relates to a copper multicomponent alloy, consisting of [in % by weight]: Ni 1.0 to 15.0% Sn 2.0 to 12.0% Mn 0.1 to 5.0% Si 0.1 to 3.0%, remainder Cu and inevitable impurities, optionally individually or in combination up to 1.5% Ti, Co, Cr, Al, Fe, Zn, Sb, optionally individually or in combination up to 0.5% B, Zr, P, S, optionally up to 25% Pb.
Claims
exact text as granted — not AI-modified1 . Copper multicomponent alloy, consisting of [in % by weight]:
Ni
1.0 to 15.0%
Sn
2.0 to 12.0%
Mn
0.1 to 5.0%
Si
0.1 to 3.0%,
remainder Cu and inevitable impurities,
optionally individually or in combination up to 1.5% Ti, Co, Cr, Al, Fe, Zn, Sb,
optionally individually or in combination up to 0.5% B, Zr, P, S,
optionally up to 25% Pb.
2 . Copper multicomponent alloy according to claim 1 , characterized in that it contains up to 2.5% Mn and up to 1.5% Si.
3 . Copper multicomponent alloy according to claim 2 , characterized in that it contains up to 1.6% Mn and up to 0.7% Si.
4 . Copper multicomponent alloy according to claim 1 , characterized in that it has undergone at least one heat treatment at 300 to 500° C.
5 . Copper multicomponent alloy according to claim 1 , characterized in that it has undergone at least one heat treatment at 600 to 800° C.
6 . Copper multicomponent alloy according to claim 1 , characterized in that it has undergone a combination of at least one solution anneal at 600 to 800° C. and at least one age-hardening treatment at 300 to 500° C.
7 . Use of the copper multicomponent alloy according to claim 1 for sliding elements or plug connectors.Join the waitlist — get patent alerts
Track US2007253858A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.