Polyamide Resin and Hinged Molded Product

Abstract

A polyamide resin comprising a dicarboxylic acid constitutional unit comprising an adipic acid unit and a diamine constitutional unit comprising a pentamethylenediamine unit and a hexamethylenediamine unit wherein a weight ratio of the pentamethylenediamine unit to the hexamethylenediamine unit being in the range of 95:5 to 60:40; a vibration-welded molded product having an excellent vibration welding strength, a hinged molded product and a binding band having an excellent low-temperature toughness, and a filament having an excellent transparency which are obtained from the polyamide resin; and a hinged molded product comprising a polyamide resin constituted of an adipic acid unit and a pentamethylenediamine unit.

1 . A polyamide resin comprising a dicarboxylic acid constitutional unit comprising an adipic acid unit and a diamine constitutional unit comprising a pentamethylenediamine unit and a hexamethylenediamine unit, a weight ratio of the pentamethylenediamine unit to the hexamethylenediamine unit being in the range of 95:5 to 5:95, and the pentamethylenediamine unit being formed from pentamethylenediamine which is produced from lysine using a lysine decarboxylase, cells capable of producing the lysine decarboxylase or a treated product of the cells.  
   
   
       2 . A polyamide resin comprising a dicarboxylic acid constitutional unit comprising an adipic acid unit and a diamine constitutional unit comprising a pentamethylenediamine unit and a hexamethylenediamine unit, a weight ratio of the pentamethylenediamine unit to the hexamethylenediamine unit being in the range of 95:5 to 60:40.  
   
   
       3 . A polyamide resin according to  claim 1 , wherein the a content of the adipic acid unit in the dicarboxylic acid constitutional unit is not less than 90% by weight, and a total content of the pentamethylenediamine unit and the hexamethylenediamine unit in the diamine constitutional unit is not less than 90% by weight.  
   
   
       4 . A polyamide resin according to  claim 1 , wherein when the polyamide resin is subjected to DSC measurement, a ratio of an endothermic peak area of the polyamide resin as measured at a temperature of not lower than 240° C. to a whole endothermic peak area thereof is not more than 60%.  
   
   
       5 . A polyamide resin according to  claim 1 , wherein the polyamide resin is a copolymer obtained by polycondensing an aliphatic diamine component comprising pentamethylenediamine and hexamethylenediamine with a dicarboxylic acid component comprising adipic acid.  
   
   
       6 . A polyamide resin according to  claim 5 , wherein the polycondensation is a heat-polycondensation.  
   
   
       7 . A polyamide resin according to  claim 5 , wherein the copolymer is obtained by polycondensing a salt of the aliphatic diamine and the dicarboxylic acid.  
   
   
       8 . A polyamide resin according to  claim 5 , wherein the pentamethylenediamine is produced from lysine using a lysine decarboxylase, cells capable of producing the lysine decarboxylase or a treated product of the cells.  
   
   
       9 . A polyamide resin composition comprising the polyamide resin as defined in  claim 1 , and an inorganic filler, a content of the inorganic filler being 0.01 to 150 parts by weight on the basis of 100 parts by weight of the polyamide resin.  
   
   
       10 . A polyamide resin composition according to  claim 9 , wherein the inorganic filler is a glass fiber.  
   
   
       11 . A vibration-welded molded product comprising the polyamide resin as defined in  claim 1  or the polyamide resin composition.  
   
   
       12 . A hinged molded product comprising the polyamide resin as defined in  claim 1  or the polyamide resin composition.  
   
   
       13 . A binding band comprising the polyamide resin as defined in  claim 1  or the polyamide resin composition.  
   
   
       14 . A filament comprising the polyamide resin  claim 1  or the polyamide resin composition.  
   
   
       15 . A hinged molded product comprising a polyamide resin constituted of an adipic acid unit and a pentamethylenediamine unit.  
   
   
       16 . A hinged molded product according to  claim 15 , wherein a content of the adipic acid unit in a dicarboxylic acid constitutional unit of the polyamide is not less than 90% by weight, and a content of the pentamethylenediamine unit in a diamine constitutional unit of the polyamide resin is not less than 90% by weight.  
   
   
       17 . A hinged molded product according to  claim 15 , wherein the polyamide resin is obtained by heat-polycondensing an aliphatic diamine component comprising pentamethylenediamine with a dicarboxylic acid component comprising adipic acid.  
   
   
       18 . A hinged molded product according to  claim 15 , wherein the polyamide resin is obtained by subjecting a salt of pentamethylenediamine and adipic acid to heat polycondensation.  
   
   
       19 . A hinged molded product according to  claim 17 , wherein the pentamethylenediamine is produced from lysine using a lysine decarboxylase, cells capable of producing the lysine decarboxylase or a treated product of the cells.