Dynamic film thickness control system/method and its utilization

Abstract

A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed.

1 - 20 . (canceled)  
   
   
       21 . A dynamic film thickness control method consisting of one or more mask plates arranged between a substrate and a vapor source; a film thickness control device provides for real-time control over coated film thickness and gradually moves the said mask plate according to the film thickness control value acquired by the said film thickness control device, enabling the said mask plates to mask film zones on the said substrate to achieve the film thickness of a design objective.  
   
   
       22 . A dynamic film thickness control method as claimed in  claim 21  in which the said one or more mask plates are arrayed in parallel and, furthermore, configured tightly flush against each other or sectionally overlaid such that there are no gaps between the said mask plates.  
   
   
       23 . A dynamic film thickness control method as claimed in  claim 21  in which displacement of the said mask plates is controlled by a mechanical arm or a clip structure.  
   
   
       24 . A dynamic film thickness control method as claimed in  claim 21  in which the said film thickness control device consists of a quartz crystal.  
   
   
       25 . A dynamic film thickness control method as claimed in  claim 21  in which the said film thickness control device consists of a light source and a detector.  
   
   
       26 . A dynamic film thickness control method as claimed in  claim 21  in which the said film thickness control device consists of the said light source and an optical fiber.  
   
   
       27 . A dynamic film thickness control method consisting of one or more mask plates arranged between a substrate and a vapor source that enables the said vapor source to disperse coating material as the said substrate is coated; a film thickness control device provides for real-time control over coated film thickness and gradually moves the said mask plate according to the film thickness control value acquired by the said film thickness control device, enabling the substrate to mask film zones on the said substrate to achieve the film thickness of a design objective and thereby complete the coating of a film layer.  
   
   
       28 . A dynamic film thickness control coating method as claimed in  claim 27  in which the said substrate is rotated, moved, or remains static as coating is executed.  
   
   
       29 . A dynamic film thickness control coating method as claimed in  claim 27  in which the said vapor source is single, multiple, or a combination of different types.  
   
   
       30 . A dynamic film thickness control coating method as claimed in  claim 27  in which the said vapor source remains static or is rotated or moved as coating is executed.