Plating apparatus

Abstract

A plating apparatus includes a bath configured to reserve a plating solution for plating a substrate and a holder configured to hold the substrate. The bath includes an anode electrode provided inside the bath. The holder includes a cathode electrode for applying a voltage to the substrate. The bath is equipped with first and second discharge portions. The plating apparatus includes a first path, a supply path, a second path and a flow rate control valve. The first path circulates the plating solution, which is discharged from the first discharge portion, to the bath. The supply path supplies the plating solution, which is provided from the first path, into the bath. The second path provides the plating solution, which is discharged from the second discharge portion after flowing on the anode electrode, to the first path. The flow rate control valve controls a flow rate of the plating solution flowing from the second path to the first path.

1 . A plating apparatus comprising: 
 a plating treatment bath configured to reserve a plating solution for plating a substrate and including an anode electrode provided inside said plating treatment bath;    a substrate holder provided above said plating treatment bath, configured to hold said substrate and including a cathode electrode for contacting said substrate to apply a voltage to said substrate;    a first flow path configured to circulate said plating solution, which is discharged from said plating treatment bath via a first discharge portion, to said plating treatment bath;    a supply path configured to supply said plating solution, which is provided from said first flow path, into said plating treatment bath;    a second flow path configured to provide said plating solution, which is discharged from said plating treatment bath via a second discharge portion after flowing on said anode electrode, to said first flow path; and    a flow rate control valve provided between said first flow path and said second flow path,    wherein said flow rate control valve is configured to control a flow rate of said plating solution provided from said second flow path to said first flow path.    
     
     
         2 . The plating apparatus according to  claim 1 , wherein said plating treatment bath includes: 
 an anode chamber provided above said anode electrode and equipped with said second discharge portion;    a membrane diffuser plate chamber provided above said anode chamber and equipped with said first discharge portion; and    a membrane provided between said anode chamber and said membrane diffuser plate chamber,    said anode chamber is configured to provide said plating solution, which is supplied via said supply path, to said flow rate control valve via said second discharge portion and said second flow path, and    said membrane diffuser plate chamber is configured to provide said plating solution, which is supplied via said supply path, to said first flow path via said first discharge portion.    
     
     
         3 . The plating apparatus according to  claim 1 , wherein said flow rate control valve is configured to control a flow rate of said plating solution flowing along said second flow path between 60 and 100 ml/min.  
     
     
         4 . The plating apparatus according to  claim 3 , wherein said supply path includes a first supply path and second supply path, 
 said first supply path is equipped with a first outlet port configured to supply said plating solution, which is provided from said first flow path, to said anode chamber,    said second supply path is equipped with a second outlet port configured to supply said plating solution, which is provided from said first flow path, to said membrane diffuser plate chamber, and    said first supply path is configured to supply said plating solution from said first outlet port such that said flow rate of said plating solution flowing along said second flow path is between 60 and 100 ml/min.    
     
     
         5 . The plating apparatus according to  claim 1 , wherein said substrate holder is configured to hold said substrate such that said substrate can rotate in a horizontal plane.  
     
     
         6 . The plating apparatus comprising: 
 a plating treatment bath configured to reserve a plating solution for plating a substrate and including an anode electrode provided inside said plating treatment bath;    a substrate holder provided above said plating treatment bath, configured to hold said substrate and including a cathode electrode for contacting said substrate to apply a voltage to said substrate;    a first flow path configured to circulate said plating solution, which is discharged from said plating treatment bath via a first discharge portion, to said plating treatment bath:    a supply path configured to supply said plating solution, which is provided from said first flow path, into said plating treatment bath; and    a second flow path configured to provide said plating solution, which is discharged from said plating treatment bath via a second discharge portion, to said first flow path,    wherein said plating treatment bath includes:    an anode chamber provided above said anode electrode and equipped with said second discharge portion;    a membrane diffuser plate chamber provided above said anode chamber and equipped with said first discharge portion; and    a membrane provided between said anode chamber and said membrane diffuser plate chamber,    said supply path includes:    a first supply path equipped with-a first outlet port configured to supply said plating solution to said anode chamber; and    a second supply path equipped with a second outlet port configured to supply said plating solution to said membrane diffuser plate chamber, and    said supply path is configured to supply said plating solution from said first outlet port such that a flow rate of said plating solution flowing along said second flow path is between 60 and 100 ml/min.    
     
     
         7 . The plating apparatus according to  claim 6 , wherein said substrate holder is configured to hold said substrate such that said substrate can rotate in a horizontal plane.