Thermoformed cover for electronic device and method for forming

Abstract

A thermoformed cover and related method for forming the thermoformed cover for an electronic device including at least one body element is made from a thermoplastic sheet having characteristics and properties to accommodate the mechanical requirements of the cover for the electronic device. The thermoplastic sheet has characteristics such that when the thermoplastic sheet is heated to a suitable temperature, the thermoplastic sheet becomes pliable and stretchable. At least a portion of the heated thermoplastic sheet is made to conform by vacuum, pressure or other suitable means to a mold arranged to substantially correspond to the desired cover for the electronic device. A thermoformed cover corresponding to the desired cover for the electronic device is formed in at least a portion of the thermoplastic sheet and the thermoformed cover is cut away or otherwise separated from the thermoplastic sheet. The thermoformed integrated cover may be arranged to replace or to envelop the cover of the electronic device or may be arranged as a protective insert cover between the body element and the cover of the electronic device.

1 . An integrated cover for an electronic device including at least one body element for carrying suitable electronic circuitry to control and carry out the intended operational functions of the electronic device, said cover comprising: 
 a thermoplastic sheet having characteristics and properties to accommodate the mechanical requirements of the cover for the electronic device;    said thermoplastic sheet further having characteristics such that when said thermoplastic sheet is heated to a suitable temperature, said thermoplastic sheet becomes pliable and stretchable wherein at least a portion of said heated thermoplastic sheet conforms to a mold arranged to substantially correspond to the desired cover for the electronic device; and    whereby a thermoformed cover corresponding to said desired cover for the electronic device is formed in said at least a portion of said thermoplastic sheet.    
     
     
         2 . The integrated cover for an electronic device as defined in  claim 1  further comprising said thermoformed cover being cut away from said at least one portion of said thermoplastic sheet.  
     
     
         3 . The integrated cover as defined in  claim 2  further being arranged for replacing the cover of the electronic device.  
     
     
         4 . The integrated cover as defined in  claim 2  further being arranged to envelop the cover of the electronic device.  
     
     
         5 . The integrated cover as defined in  claim 2  further being arranged as a protective insert cover between the body element and the cover of the electronic device.  
     
     
         6 . The integrated cover as defined in  claim 1  wherein said thermoformed cover is a vacuum thermoformed cover.  
     
     
         7 . The integrated cover as defined in  claim 1  wherein the thermoformed cover is a pressure thermoformed cover.  
     
     
         8 . The integrated cover as defined in  claim 1  wherein the thermoformed cover has a size and shape generally conforming to the size and shape of the body element.  
     
     
         9 . The integrated cover as defined in  claim 8  wherein said thermoformed cover has an exterior face surface and a suitable window area defined in at least a portion of said exterior face surface for viewing the visible display of information shown on a screen constructed in at least a portion of the body element.  
     
     
         10 . The integrated cover as defined in  claim 9  further comprising a border outline silk screen printed on said exterior face surface around said window area.  
     
     
         11 . The integrated cover as defined in  claim 9  further comprising at least one pattern silk screen printed on said exterior face surface.  
     
     
         12 . The integrated cover as defined in  claim 1  further comprising indicia silk screen printed on said exterior face surface at one or more locations corresponding to a desired predetermined functionality associated with the electronic device.  
     
     
         13 . The integrated cover as defined in  claim 1  wherein said thermoplastic sheet further includes keymat functionality.  
     
     
         14 . The integrated cover as defined in  claim 13  wherein said thermoplastic sheet further includes an adapter plug for electrically connecting said integrated keymat to the electronic circuitry carried by the body element.  
     
     
         15 . The integrated cover as defined in  claim 1  wherein said electronic device further comprises a portable electronic device.  
     
     
         16 . The integrated cover as defined in  claim 1  wherein said electronic device further comprises a mobile telephone.  
     
     
         17 . Method, comprising: 
 providing an integrated cover for an electronic device having at least one body element further comprising:    providing a thermoplastic sheet;    providing a suitable mold arranged to substantially correspond to the desired cover for the electronic device;    heating the thermoplastic sheet to a suitable temperature;    conforming at least a portion of the heated thermoplastic sheet to the mold; and    cooling and removing the thermoplastic sheet from the mold, whereby a thermoformed cover corresponding to said desired cover for the electronic device is formed in said at least one portion of the thermoplastic sheet.    
     
     
         18 . The method as defined in  claim 17  further providing a thermoplastic sheet having characteristics and properties to accommodate the mechanical requirements of the cover for the electronic device.  
     
     
         19 . The method as defined in  claim 17  further including separating the thermoformed cover away from the thermoplastic sheet.  
     
     
         20 . The method as defined in  claim 17  further including conforming by vacuum to draw the heated thermoplastic sheet against the mold to form the thermoformed cover.  
     
     
         21 . The method as defined in  claim 17  further including conforming by pressure to press the heated thermoplastic sheet against the mold to form the thermoformed cover.  
     
     
         22 . The method as defined in  claim 17  further providing a thermoplastic sheet with keymat functionality.  
     
     
         23 . The method as defined in  claim 22  further providing a thermoplastic sheet having an adapter plug for electrically connecting the integrated keymat to the electrical circuitry of the electronic device.  
     
     
         24 . The method as defined in  claim 17  further including silk screen printing on the exterior facing surface of the thermoplastic sheet corresponding to the outward facing surface of the thermoformed cover at least one of desired text, graphics, patterns, and window outline borders, whereby the silk screen printed text, graphics, patterns and window outline border appears on the exterior outward facing surface of the thermoformed cover.