Support structure for a planar cooling device
Abstract
A support structure for a compact planar cooling device is presented. The support structure allows the cooling device to be made with a simpler structure than most conventional cooling devices. The cooling device includes a planar casing, a wick layer, and the support structure. The support structure includes a flat plate with a portion cut out to form an opening and a spacer on the flat plate. The spacer is made by bending or folding the cut-out portion of the plate. The spacer enhances coolant circulation inside the cooling device by pushing the wick layer against the inner surface of the casing and maintaining a set distance between the support structure and the casing to allow unimpeded coolant movement. The cooling device can be made cost-effectively without compromising heat transfer efficiency.
Claims
exact text as granted — not AI-modified1 . A support structure for a cooling device, the support structure comprising:
a flat plate with a portion cut out to form an opening; and a spacer on the flat plate, wherein the spacer is made by bending the cut-out portion of the flat plate.
2 . The support structure of claim 1 , wherein the cut-out portion is bent while partially attached to the flat plate so that the spacer is attached to the flat plate.
3 . The support structure of claim 1 , wherein two cut-out portions are formed in forming the opening, and wherein the two-cutout portions are made into two spacers.
4 . The support structure of claim 3 , wherein the flat plate is cut out in the shape of an H so that the opening is a rectangular opening and the two spacers are formed along parallel sides of the rectangular opening.
5 . The support structure of claim 3 , wherein the two cut-out portions are bent in different directions so that the two spacers are formed on different surfaces of the flat plate.
6 . The support structure of claim 3 , wherein the two cut-out portions are bent in the same direction so that the two spacers are formed on the same surface of the flat plate.
7 . The support structure of claim 1 , wherein bending the cut-out portion of the flat plate comprises folding the cut-out portion onto a surface of the flat plate.
8 . The support structure of claim 1 , wherein bending the cut-out portion of the flat plate comprises bending the cut-out portion so that it forms a substantially 90°-angle with respect to the flat plate.
9 . The support structure of claim 1 further comprising a plurality of cut-out portions that form a plurality of openings and a plurality of spacers.
10 . The support structure of claim 1 , wherein the flat plate is made of one of aluminum, titanium, plastic, metallized plastic, graphite, and copper.
11 . A cooling device comprising:
a planar casing; a wick layer positioned inside the casing; and a support structure positioned inside the casing, wherein the support structure has:
a flat plate with a portion cut out to form an opening; and
a spacer on the flat plate, wherein the spacer is made by bending the cut-out portion of the flat plate.
12 . The device of claim 11 , wherein the planar casing comprises a first plate and a second plate attached together to form a space between them.
13 . The device of claim 11 , wherein the planar casing comprises a flattened tube.
14 . The device of claim 11 , wherein the planar casing has fins.
15 . The device of claim 4 , wherein the fins have a hollow space so that fluid in the planar casing travels in the hollow space.
16 . The device of claim 11 , wherein the wick layer is positioned between an inner surface of the planar casing and the support structure.
17 . The device of claim 11 , wherein the wick layer is attached to an inner surface of the planar casing.
18 . The device of claim 11 , wherein the wick layer is a first wick layer, further comprising a second wick layer positioned on the other side of the support structure from the first wick layer.
19 . The device of claim 11 , wherein the wick layer is a copper felt layer.
20 . The device of claim 11 , wherein the wick layer is a hydrophilic wick capable of absorbing fluid by capillary force.
21 . The device of claim 111 , wherein the cut-out portion of the support structure is bent while partially attached to the flat plate so that the spacer is attached to the flat plate.
22 . The device of claim 11 , wherein there are two cut-out portions formed in forming the opening and the two cut-out portions are made into two spacers.
23 . The device of claim 22 , wherein the opening is a rectangular opening and the two spacers are formed along parallel sides of the rectangular opening.
24 . The device of claim 22 , wherein the two cut-out portions are bent in different directions so that the two spacers are formed on different surfaces of the flat plate.
25 . The device of claim 22 , wherein the two cut-out portions are bent in the same direction so that the two spacers are formed on the same surface of the flat plate.
26 . The device of claim 11 , wherein bending the cut-out portion of the flat plate comprises folding the cut-out portion onto a surface of the flat plate.
27 . The device of claim 11 , wherein bending the cut-out portion of the flat plate comprises bending the cut-out portion so that it forms a substantially 90°-angle with respect to the flat plate.
28 . The device of claim 11 , wherein the support structure has a plurality of cut-out portions that form a plurality of openings and a plurality of spacers.
29 . A method of making a cooling device, the method comprising forming a support structure by:
providing a flat plate; cutting a portion of the flat plate to create an opening; and forming a spacer on the flat plate by bending the cut portion of the flat plate.
30 . The method of claim 29 further comprising placing the support structure in a planar casing.
31 . The method of claim 30 further comprising attaching the support structure to the planar casing by welding or soldering.
32 . The method of claim 30 further comprising placing a wick layer inside the planar casing.
33 . The method of claim 32 , wherein the wick layer is a first wick layer, further comprising placing a second wick layer inside the planar casing such that the first and the second wick layers are on different sides of the support structure.
34 . The method of claim 30 further comprising forming the planar casing by attaching a first plate and a second plate with a seal.
35 . The method of claim 30 further comprising forming the planar casing by flattening a cylindrical tube.
36 . The method of claim 30 further comprising forming fins on the planar casing.
37 . The method of claim 30 further comprising forming hollow spaces inside the fins so that fluid in the planar casing can travel inside the fins.
38 . The method of claim 29 , wherein the forming of the spacer on the flat plate comprises bending the cut portion of the flat plate while a part of the cut portion is attached to the flat plate.
39 . The method of claim 29 , wherein forming of the spacer on the flat plate comprises forming a plurality of spacers for the opening.
40 . The method of claim 39 , wherein the plurality of spacers are formed on different sides of the support structure.
41 . The method of claim 39 , wherein the plurality of spacers are formed on the same side of the support structure.
42 . The method of claim 29 , wherein bending the cut portion comprises folding the cut portion against the flat plate.
43 . The method of claim 29 , wherein bending the cut portion comprise forming a substantially 90°-angle between the cut portion and the flat plate.
44 . The method of claim 29 wherein the cutting of the portion of the flat plate comprises cutting an “H” pattern on the flat plate to form two flaps that are capable of being bent to form the opening.
45 . The method of claim 29 wherein the cutting of the portion of the flat plate comprises cutting a “C” or a “U” pattern on the flat plate to produce a flap capable of being bent to form the opening.Join the waitlist — get patent alerts
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