Surface Treated Copper Foil, Flexible Copper-Clad Laminate Manufactured Using the Same, and Film Carrier Tape

Abstract

An object of the invention is to provide a surface treated copper foil and the like, which ensure practically sufficient adhesion when a copper foil having no roughening treatment applied hereto is bonded with a polyimide resin substrate and which have no slip-in of plated tin. To attain the object, there is employed a surface treated copper foil for a polyimide resin substrate characterized by being an electro-deposited copper foil having a surface treatment layer for improving adhesion to the polyimide resin substrate on a shiny surface side, in which, the surface treatment layer is a nickel-zinc alloy layer or a cobalt-zinc alloy layer containing nickel or cobalt in an amount of 65 wt % to 90 wt % and zinc in an amount of 10 wt % to 35 wt % except for inevitable impurities and having a weight thickness of 30 mg/m 2 to 70 mg/m 2 .

1 . A surface treated copper foil for a polyimide resin substrate, which is an electro-deposited copper foil having a surface treatment layer for improving adhesion to a polyimide resin substrate, 
 wherein the surface treatment layer is provided on a shiny surface side of the electro-deposited copper foil and is a nickel-zinc alloy layer or a cobalt-zinc alloy layer containing nickel or cobalt in an amount of 65 wt % to 90 wt % and zinc in an amount of 10 wt % to 35 wt % except for inevitable impurities and having a weight thickness of 30 mg/m 2  to 70 mg/m 2 .    
   
   
       2 . The surface treated copper foil for a polyimide resin substrate according to  claim 1 , wherein the shiny surface has a roughness (Rzjis) of 2.0 μm or less.  
   
   
       3 . The surface treated copper foil according to  claim 1 , wherein the surface having the surface treatment layer has a glossiness [Gs(60°)] of 180% or less.  
   
   
       4 . The surface treated copper foil for a polyimide resin substrate according to  claim 1 , wherein a silane coupling agent treatment layer is provided at an outermost layer of a bonding surface of the electro-deposited copper foil in contact with the polyimide resin substrate.  
   
   
       5 . The surface treated copper foil for a polyimide resin substrate according to  claim 4 , wherein the silane coupling agent treatment layer is formed of an amino silane coupling agent or a mercapto silane coupling agent.  
   
   
       6 . A surface treated copper foil for a polyimide resin substrate, which is an electro-deposited copper foil having a surface treatment layer for improving adhesion to a polyimide resin substrate at a shiny surface side, 
 wherein the surface treatment layer is provided at the shiny surface side of the electro-deposited copper foil and is a nickel-zinc-cobalt alloy layer satisfying the following conditions A to C,    A: the total content of a cobalt content and a nickel content is 65 wt % to 90 wt % and a zinc content is 10 wt % to 35 wt % except for inevitable impurities;    B: nickel is contained in the range of 10 wt % to 70 wt % and cobalt is contained in the range of 18 wt % to 72 wt %; and    C: a weight thickness of the nickel-zinc-cobalt alloy layer is 30 mg/m 2  to 70 mg/m 2 .    
   
   
       7 . The surface treated copper foil for a polyimide resin substrate according to  claim 6 , wherein the shiny surface has a roughness (Rzjis) of 2.0 μm or less.  
   
   
       8 . The surface treated copper foil according to  claim 6 , wherein the surface having the surface treatment layer has a glossiness [Gs(60°)] of 180% or less.  
   
   
       9 . The surface treated copper foil for a polyimide resin substrate according to  claim 6 , wherein a silane coupling agent treatment layer is provided at an outermost layer of a bonding surface of the electro-deposited copper foil in contact with the polyimide resin substrate.  
   
   
       10 . The surface treated copper foil for a polyimide resin substrate according to  claim 6 , wherein the silane coupling agent treatment layer is formed of an amino silane coupling agent or a mercapto silane coupling agent.  
   
   
       11 . A surface treated copper foil for a polyimide resin substrate, which is an electro-deposited copper foil having a surface treatment layer for improving adhesion to a polyimide resin substrate, 
 wherein the surface treatment layer is provided on a matte surface side of the electro-deposited copper foil and is a nickel-zinc alloy layer or a cobalt-zinc alloy layer containing nickel or cobalt in an amount of 65 wt % to 90 wt % and zinc in an amount of 10 wt % to 35 wt % except for inevitable impurities and having a weight thickness of 35 mg/m 2  to 120 mg/m 2 .    
   
   
       12 . The surface treated copper foil for a polyimide resin substrate according to  claim 11 , wherein the matte surface has a roughness (Rzjis) exceeding 1.0 μm.  
   
   
       13 . The surface treated copper foil for a polyimide resin substrate according to  claim 11 , wherein a chromate layer is provided on a surface of the surface treatment layer as a rust proofing layer.  
   
   
       14 . The surface treated copper foil for a polyimide resin substrate according to  claim 11 , wherein a silane coupling agent treatment layer is provided at an outermost layer of a bonding surface of the electro-deposited copper foil in contact with the polyimide resin substrate.  
   
   
       15 . The surface treated copper foil for a polyimide resin substrate according to  claim 14 , wherein the silane coupling agent treatment layer is formed of an amino silane coupling agent or a mercapto silane coupling agent.  
   
   
       16 . A surface treated copper foil for a polyimide resin substrate, which is an electro-deposited copper foil having a surface treatment layer for improving adhesion to a polyimide resin substrate, 
 wherein the surface treatment layer is provided at the matte surface side of the electro-deposited copper foil and is a nickel-zinc-cobalt alloy layer satisfying the following conditions A to C,    A: the total content of a cobalt content and a nickel content is 65 wt % to 90 wt % and a zinc content is 10 wt % to 35 wt % except for inevitable impurities;    B: nickel is contained in the range of 10 wt % to 70 wt % and cobalt is contained in 18 wt % to 72 wt %; and    C: a weight thickness of the nickel-zinc-cobalt alloy layer is 35 mg/m 2  to 120 mg/m 2 .    
   
   
       17 . The surface treated copper foil for a polyimide resin substrate according to  claim 16 , wherein the matte surface has a roughness (Rzjis) exceeding 1.0 μm.  
   
   
       18 . The surface treated copper foil for a polyimide resin substrate according to  claim 16 , wherein a chromate layer is provided on a surface of the surface treatment layer as a rust proofing layer.  
   
   
       19 . The surface treated copper foil for a polyimide resin substrate according to  claim 16 , wherein a silane coupling agent treatment layer is provided at an outermost layer of a bonding surface of the electro-deposited copper foil in contact with the polyimide resin substrate.  
   
   
       20 . The surface treated copper foil for a polyimide resin substrate according to  claim 16 , wherein the silane coupling agent treatment layer is formed of an amino silane coupling agent or a mercapto silane coupling agent.  
   
   
       21 . A surface treated copper foil provided with a carrier foil for a polyimide resin substrate, which is an electro-deposited copper foil provided with a carrier foil having a surface treatment layer for improving adhesion to a polyimide resin substrate, 
 wherein the electro-deposited copper foil provided with a carrier foil is formed by successively laminating a carrier foil layer, a bonding interface layer and an electro-deposited copper foil layer; on the surface of the electro-deposited copper foil layer, the surface treatment layer is provided, which is characterized by being a nickel-zinc alloy layer or a cobalt-zinc alloy layer containing nickel or cobalt in an amount of 65 wt % to 90 wt % and zinc in an amount of 10 wt % to 35 wt % except for inevitable impurities, and having a weight thickness of 35 mg/m 2  to 70 mg/m 2 .    
   
   
       22 . The surface treated copper foil provided with a carrier foil for a polyimide resin substrate according to  claim 21 , wherein a chromate layer is provided on a surface of the surface treatment layer as a rust proofing layer.  
   
   
       23 . The surface treated copper foil provided with a carrier foil for a polyimide resin substrate according to  claim 21 , wherein a silane coupling agent treatment layer is provided at an outermost layer of a bonding surface of the electro-deposited copper foil in contact with the polyimide resin substrate.  
   
   
       24 . The surface treated copper foil provided with a carrier foil for a polyimide resin substrate according to  claim 23 , wherein the silane coupling agent treatment layer is formed of an amino silane coupling agent or a mercapto silane coupling agent.  
   
   
       25 . A surface treated copper foil provided with a carrier foil for a polyimide resin substrate, which is an electro-deposited copper foil provided with a carrier foil having a surface treatment layer for improving adhesion to a polyimide resin substrate, 
 wherein the electro-deposited copper foil provided with a carrier foil is formed by successively laminating a carrier foil layer, a bonding interface layer and an electro-deposited copper foil layer; and a nickel-zinc-cobalt alloy layer satisfying the following conditions A to C is provided as the surface treatment layer on the surface of the electro-deposited copper foil layer,    A: the total content of a cobalt content and a nickel content is 65 wt % to 90 wt % and a zinc content is 10 wt % to 35 wt % except for inevitable impurities;    B: nickel is contained in the range of 10 wt % to 70 wt % and cobalt is contained in the range of 18 wt % to 72 wt %; and    C: a weight thickness of the nickel-zinc-cobalt alloy layer is 35 mg/m 2  to 70 mg/m 2 .    
   
   
       26 . The surface treated copper foil provided with a carrier foil for a polyimide resin substrate according to  claim 25 , wherein a chromate layer is provided on a surface of the surface treatment layer as a rust proofing layer.  
   
   
       27 . The surface treated copper foil provided with a carrier foil for a polyimide resin substrate according to any one of  claim 25 , wherein a silane coupling agent treatment layer is provided at an outermost layer of a bonding surface of the electro-deposited copper foil in contact with the polyimide resin substrate.  
   
   
       28 . The surface treated copper foil provided with a carrier foil for a polyimide resin substrate according to  claim 25 , wherein the silane coupling agent treatment layer is formed of an amino silane coupling agent or a mercapto silane coupling agent.  
   
   
       29 . A flexible copper-clad laminate obtained by directly laminating the surface treated copper foil according to  claim 1  and a polyimide resin substrate.  
   
   
       30 . A flexible copper-clad laminate obtained by directly laminating the surface treated copper foil according to  claim 6  and a polyimide resin substrate.  
   
   
       31 . A flexible copper-clad laminate obtained by directly laminating the surface treated copper foil according to  claim 11  and a polyimide resin substrate.  
   
   
       32 . A flexible copper-clad laminate obtained by directly laminating the surface treated copper foil according to  claim 16  or a surface treated copper foil provided with a carrier foil and a polyimide resin substrate.  
   
   
       33 . A flexible copper-clad laminate obtained by directly laminating the surface treated copper foil provided with a carrier foil according to  claim 21  and a polyimide resin substrate.  
   
   
       34 . A flexible copper-clad laminate obtained by directly laminating the surface treated copper foil provided with a carrier foil according to  claim 25  and a polyimide resin substrate.  
   
   
       35 . A film carrier tape for TAB obtained by directly laminating the surface treated copper foil according to  claim 1  and a polyimide resin tape.  
   
   
       36 . A film carrier tape for TAB obtained by directly laminating the surface treated copper foil according to  claim 6  and a polyimide resin tape.  
   
   
       37 . A film carrier tape for TAB obtained by directly laminating the surface treated copper foil according to  claim 11  and a polyimide resin tape.  
   
   
       38 . A film carrier tape for TAB obtained by directly laminating the surface treated copper foil according to  claim 16  and a polyimide resin tape.  
   
   
       39 . A film carrier tape for TAB obtained by directly laminating the surface treated copper foil provided with a carrier foil according to  claim 21  and a polyimide resin tape.  
   
   
       40 . A film carrier tape for TAB obtained by directly laminating the surface treated copper foil provided with a carrier foil according to  claim 25  and a polyimide resin tape.