Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Device

Abstract

A semiconductor device includes a wiring board having a wiring pattern, a semiconductor chip that has an integrated circuit and is mounted on a first surface of the wiring board to electrically connect with the wiring pattern, a spacer that is disposed on a second surface of the wiring board and has inside thereof an electronic component that is electrically connected with the wiring pattern and an external terminal that is disposed on the second surface and electrically connected with the wiring pattern.

1 - 20 . (canceled)  
   
   
       21 . A semiconductor device, comprising: 
 a wiring board that has a wiring pattern;    a semiconductor chip that has an integrated circuit, the semiconductor chip being disposed on a first surface of the wiring board, the semiconductor chip being electrically connected with the wiring pattern;    a plurality of electronic components that are disposed on a second surface of the wiring board opposite to the first surface of the wiring board, the plurality of electronic components being electrically connected to the wiring pattern;    a resin that is disposed on the second surface of the wiring board, the resin covering the plurality of electronic components, the resin including a first surface being facing the second surface of the wiring board and a second surface opposite to the first surface of the resin, the second surface of the resin being flat; and    an external terminal that is disposed on the second surface of the wiring board, the external terminal being electrically connected with the wiring pattern.    
   
   
       22 . The semiconductor device according to  claim 21 , the external terminal having a height higher than that of the resin.  
   
   
       23 . The semiconductor device according to  claim 21 , the resin covering each of first surfaces of the plurality of electronic components opposite to each of second surfaces of the plurality of electronic components, the each of the second surfaces of the plurality of electronic components facing the second surface of the wiring board.  
   
   
       24 . The semiconductor device according to  claim 21 , one of the plurality of the electronic components being a chip component.  
   
   
       25 . The semiconductor device according to  claim 21 , one of the plurality of the electronic components being a capacitor.  
   
   
       26 . The semiconductor device according to  claim 21 , one of the plurality of the electronic components being a coil.  
   
   
       27 . An electronic device comprising: 
 a wiring board that has a first wiring pattern;    a semiconductor chip that has an integrated circuit, the semiconductor chip being disposed on a first surface of the wiring board, the semiconductor chip being electrically connected with the first wiring pattern;    a plurality of electronic components that are disposed on a second surface of the wiring board opposite to the first surface of the wiring board, the plurality of electronic components being electrically connected to the first wiring pattern;    a resin that is disposed on the second surface of the wiring board, the resin covering the plurality of electronic components, the resin including a first surface being facing the second surface of the wiring board and a second surface opposite to the first surface of the resin, the second surface of the resin being flat;    an external terminal that is disposed on the second surface of the wiring board, the external terminal being electrically connected with the first wiring pattern; and    a circuit board that has a second wiring pattern, the second wiring pattern having a part being in contact with the external terminal.    
   
   
       28 . The electronic device according to  claim 27 , the second surface of the resin being in contact with the circuit board.  
   
   
       29 . A method of manufacturing a semiconductor device, comprising: 
 preparing a wiring board having a first surface on which a semiconductor chip is mounted and a second surface on which a plurality of electronic components are mounted; and    forming on the second surface a resin covering the plurality of electronic components, a first surface of the resin being flat, a second surface of the resin facing the wiring board, the second surface being opposite to the first surface of the resin.    
   
   
       30 . The method of manufacturing a semiconductor device according to  claim 29 , further comprising disposing an external terminal on the second surface.  
   
   
       31 . The method of manufacturing a semiconductor device according to  claim 30 , the external terminal being formed so as to be higher in height than the spacer.  
   
   
       32 . The method of manufacturing a semiconductor device according to  claim 29 , forming the resin being performed according to a molding process.  
   
   
       33 . The method of manufacturing a semiconductor device according to  claim 29 , forming the resin including; 
 setting the wiring board to a molding die so that the plurality of the electronic components are in a cavity of the molding die; and    filling the resin in the cavity.    
   
   
       34 . The method of manufacturing a semiconductor device according to  claim 29 , one of the plurality of the electronic components being a chip component.  
   
   
       35 . The method of manufacturing a semiconductor device according to  claim 29 , one of the plurality of the electronic components being a capacitor.  
   
   
       36 . The method of manufacturing a semiconductor device according to  claim 29 , one of the plurality of the electronic components being a coil.  
   
   
       37 . A method of manufacturing an electronic component, comprising: 
 preparing a wiring board having a first surface on which a semiconductor chip is mounted, a second surface on which a plurality of electronic components are mounted, and an external electrode being disposed on the second surface;    forming on the second surface a resin covering the plurality of electronic components, a first surface of the resin being flat, a second surface of the resin facing the wiring board, the second surface being opposite to the first surface of the resin; and    mounting the wiring board on a circuit board via the external electrode.    
   
   
       38 . The method of manufacturing an electronic device according to  claim 37 , the wiring board being mounted so that the first surface of the resin is in contact with the wiring board.