PDC cutter for high compressive strength and highly abrasive formations
Abstract
A PDC cutter utilizes the combination of an elliptical shape with higher thermal resistance obtained through leaching to provide a cutter which is more effective than a cutter using either concept alone. The PDC cutter includes a tungsten carbide portion with protrusions extending from a surface thereof in a pattern. The diamond volume is mounted to the surface wherein the protrusions allow for the diamond volume to be larger about a perimeter edge of the cutter and smaller/shallower in a center region of the cutter. The protrusions providing surfaces for the diamond layer (table) to bond to the underlying tungsten carbide portion. With this configuration, diamond volume is maximized around the edge of the cutter.
Claims
exact text as granted — not AI-modified1 . A PDC cutter, comprising:
a tungsten carbide substrate having a top surface including a protrusion pattern formed in a center portion of the top surface; and a diamond table mounted to the top surface of the tungsten carbide substrate; wherein the diamond table is thicker at a perimeter of the top surface and thinner at the center portion of the top surface; and wherein the diamond table is leached.
2 . The cutter of claim 1 wherein the cutter has an elliptical shape having a major axis and a minor axis.
3 . The cutter of claim 2 wherein a top surface of the diamond table has a concave shape oriented through the major axis.
4 . The cutter of claim 2 wherein a top surface of the diamond table has a concave shape oriented through the minor axis.
5 . A PDC cutter, comprising:
a tungsten carbide substrate; and a diamond table mounted to the top surface of the tungsten carbide substrate, the diamond table presenting a chisel forward shape; wherein the cutter has an elliptical shape ; and wherein the diamond table is leached.
6 . A PDC cutter, comprising:
a tungsten carbide substrate having a top surface including a protrusion pattern; and a diamond table mounted to the top surface of the tungsten carbide substrate; wherein the diamond table is thicker at a perimeter of the top surface and thinner at the center portion of the top surface; and wherein the diamond table is leached.
7 . The cutter of claim 6 wherein the cutter has an elliptical shape having a major axis and a minor axis.
8 . The cutter of claim 7 wherein a top surface of the diamond table has a concave shape oriented through the major axis.
9 . The cutter of claim 7 wherein a top surface of the diamond table has a concave shape oriented through the minor axis.Join the waitlist — get patent alerts
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